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Inventor

Yukihiro Wada

Inventor
Kitakyushu, JP

Overview

2→
Patents
1991–1997
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

A23Gprimary
A23GCocoa14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form14%
C08LCompositions of macromolecular compounds14%
C09JAdhesives14%
H05KPrinted circuits14%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
5,677,393'Heat-resistant film adhesive for use in fabrication of printed circuit boards and process for using the same'19974,988,529'Milk shake and manufacturing method thereof'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991Patents assigned to NISSEI KK (1)· patent assignee history
1991Based in Osaka, JP· patent location history
1997Patents assigned to NIPPON STEEL CHEMICAL CO (1)· patent assignee history
1997Based in Kitakyushu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIPPON STEEL CHEMICAL CO11997
NISSEI KK11991
Locations
LocationPatentsSpan
Kitakyushu, JP11997
Osaka, JP11991