Inventor
YEONHO JANG
Inventor
KR
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
PatentTitleYear
12,482,721Semiconductor package including heat dissipation structure202512,261,104Semiconductor package and method of fabricating the same202512,087,744Semiconductor package device202411,901,276Semiconductor package and method of manufacturing the same202411,869,835Semiconductor package202411,791,295Semiconductor package with thick under-bump terminal202311,637,081Semiconductor package and method of manufacturing the same202311,616,051Semiconductor package device202311,569,157Semiconductor package and method of manufacturing the same202311,456,241Semiconductor package202211,145,611Semiconductor package and method of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (11)· patent assignee history
2021–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 11 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 11 | 2021–2025 |