Inventor
Lovell B. Wiggins
Inventor
Hopewell Junction, NY, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
C04BLime, magnesia16%
C03CChemical composition of glasses, glazes or vitreous enamels5%
H01BCables5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
6,596,621'Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate'20035,950,073'Self-adjusting semiconductor package stand-offs'19995,277,725'Process for fabricating a low dielectric composite substrate'19945,215,610'Method for fabricating superconductor packages'19935,139,851'Low dielectric composite substrate'19925,135,595'Process for fabricating a low dielectric composite substrate'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2003Patents assigned to IBM (6)· patent assignee history
1992–2003Based in Hopewell Junction, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 1992–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 6 | 1992–2003 |