Inventor
Ching-Huei Su
Inventor
Kaohsiung, TW
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1069%
H05KPrinted circuits13%
B23KSoldering or unsoldering8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
C23FNon-mechanical removal of metallic material from surface3%
C25FProcesses for the electrolytic removal of materials from objects3%
PatentTitleYear
8,288,853'Three-dimensional package and method of making the same'20127,741,152'Three-dimensional package and method of making the same'20107,642,132'Three-dimensional package and method of making the same'20107,528,053'Three-dimensional package and method of making the same'20097,446,404'Three-dimensional package and method of making the same'20087,253,519'Chip packaging structure having redistribution layer with recess'20077,064,428'Wafer-level package structure'20066,989,326'Bump manufacturing method'20066,967,153'Bump fabrication process'20056,927,964'Structure for preventing burnt fuse pad from further electrical connection'20056,921,716'Wafer bumping process'20056,877,653'Method of modifying tin to lead ratio in tin-lead bump'20056,875,683'Method of forming bump'20056,861,346'Solder ball fabricating process'20056,846,719'Process for fabricating wafer bumps'20056,827,252'Bump manufacturing method'20046,756,256'Method for preventing burnt fuse pad from further electrical connection'20046,743,707'Bump fabrication process'20046,732,912'Solder ball attaching process'20046,723,630'Solder ball fabrication process'20046,720,244'Bump fabrication method'20046,716,739'Bump manufacturing method'20046,713,320'Bumping process'20046,673,711'Solder ball fabricating process'20046,664,128'Bump fabrication process'20036,617,237'Lead-free bump fabrication process'20036,265,768'Chip scale package'20016,221,697'Chip scale package and manufacturing method thereof'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2012Patents assigned to ADVANCED SEMICONDUCTOR ENG (28)· patent assignee history
2001–2012Based in Kaohsiung, TW· patent location history
2012Patents assigned to CHENG PO-JEN (1)· patent assignee history
2012Patents assigned to HUANG MIN-LUNG (1)· patent assignee history
2012Patents assigned to LIN CHIAN-CHI (1)· patent assignee history
2012Patents assigned to LO JIAN-WEN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 28 | 2001–2012 |
| CHENG PO-JEN | 1 | 2012 |
| HUANG MIN-LUNG | 1 | 2012 |
| LIN CHIAN-CHI | 1 | 2012 |
| LO JIAN-WEN | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 28 | 2001–2012 |