Inventor

Yoshimitsu Terakado

Inventor

Tokyo, JP

Overview

1990–2003

Patent span

Electricity

Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%

B23KSoldering or unsoldering36%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

B65HHandling thin or filamentary material, e.g. sheets, webs, cables2%

G01BMeasuring length, thickness or similar linear dimensions2%

G01RMeasuring electric variables2%

G05BControl or regulating systems in general2%

H05KPrinted circuits2%

Y10TTechnical subjects covered by former us classification2%

PatentTitleYear

6,645,346'Workpiece holding device for a bonding apparatus'2003 6,595,400'Wire bonding apparatus'2003 6,502,738'Wire bonding apparatus'2003 6,491,203'Wire bonding apparatus'2002 6,439,496'Spool holder structure for a wire bonder'2002 6,141,599'Method for setting conveying data for a lead frame'2000 6,129,255'Wire bonding apparatus'2000 5,988,482'Discharge abnormality detection device and method for use in wire bonding apparatus'1999 5,975,835'Lead frame conveying method and conveying apparatus'1999 5,903,463'Raising-and-lowering data setting method for magazine elevator device'1999 5,524,811'Wire bonding method'1996 5,485,063'Motor control circuit for a wire bonding apparatus'1996 5,468,927'Wire bonding apparatus'1995 5,386,936'Wire bonding method'1995 5,287,064'Bonding point polarity determining apparatus'1994 5,221,037'Wire bonding method and apparatus'1993 5,219,112'Wire bonding apparatus'1993 5,214,259'Method and apparatus for forming a ball at a bonding wire end'1993 5,207,370'Wire bonding method and apparatus'1993 5,192,018'Wire bonding method'1993 5,123,585'Wire bonding method'1992 5,058,797'Detection method for wire bonding failures'1991 5,046,655'Device for detecting height of bonding surface'1991 5,046,654'Ultrasonic wire bonding apparatus'1991 5,024,367'Wire bonding method'1991 5,016,803'Wire bonding apparatus'1991 4,932,584'Method of wire bonding'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–2003Patents assigned to SHINKAWA KK (27)· patent assignee history

1990–2003Based in Tokyo, JP· patent location history

1995–2003Based in Hachioji, JP· patent location history

1999–2000Based in Hachiouji, JP· patent location history

1999Based in Hachijoji, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINKAWA KK	27	1990–2003

Locations

Location	Patents	Span
Tokyo, JP	17	1990–2003
Hachioji, JP	7	1995–2003
Hachiouji, JP	2	1999–2000
Hachijoji, JP	1	1999