Inventor
YUNG-CHING CHEN
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10DInorganic electric semiconductor devices16%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation16%
H03KPulse technique5%
PatentTitleYear
11,996,368Pad structure for enhanced bondability202411,804,826Semiconductor devices with flexibility in capacitor design for power noise reduction202311,728,279Pad structure for enhanced bondability2023RE049045Package on package devices and methods of packaging semiconductor dies202211,227,836Pad structure for enhanced bondability202211,139,281Molded underfilling for package on package devices2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2021–2024Based in TW· patent location history
2023Patents assigned to MEDIATEK SINGAPORE PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2021–2024 |
| MEDIATEK SINGAPORE PTE LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2021–2024 |