Inventor
Richard Keith McMillan
Inventor
Dearborn, MI, US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
Y02PClimate change mitigation technologies in the production or processing of goods14%
Y10TTechnical subjects covered by former us classification13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
B23KSoldering or unsoldering3%
B29CShaping or joining of plastics3%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts3%
B29LIndexing scheme associated with subclass b29c, relating to particular articles3%
F02DControlling combustion engines3%
F02MSupplying combustion engines in general with combustible mixtures or constituents thereof3%
PatentTitleYear
7,102,888'Electronically integrated vehicle structure'20067,048,423'Integrated light and accessory assembly'20067,000,969'Instrument panel with integrated HVAC and electronic systems'20066,975,805'Light channel communication system'20056,772,733'Optically controlled IPCS circuitry'20046,717,067'Circuit board and a method for making the same'20046,673,723'Circuit board and a method for making the same'20046,613,239'Method for making an electrical circuit board'20036,501,031'Electrical circuit board and a method for making the same'20026,499,214'Method of making a circuit board'20026,467,161'Method for making a circuit board'20026,405,920'Enhanced mounting pads for printed circuit boards'20026,316,736'Anti-bridging solder ball collection zones'20016,303,872'Anti-tombstoning solder joints'20016,299,469'Flexible circuit board splice clamp'20016,169,253'Solder resist window configurations for solder paste overprinting'20016,115,262'Enhanced mounting pads for printed circuit boards'20005,979,043'Method of manufacturing a circuit assembly from two or more layers of flexible film'19995,936,846'Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips'19995,931,371'Standoff controlled interconnection'19995,929,375'EMI protection and CTE control of three-dimensional circuitized substrates'19995,917,704'Laser-solderable electronic component'19995,878,487'Method of supporting an electrical circuit on an electrically insulative base substrate'19995,842,275'Reflow soldering to mounting pads with vent channels to avoid skewing'19985,663,529'Anti-skew mounting pads and processing method for electronic surface mount components'19975,639,013'Optimally shaped solder joints for improved reliability and space savings'19975,364,011'Micro soldering system for electronic components'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2000Patents assigned to FORD MOTOR CO (10)· patent assignee history
1994–2006Based in Dearborn, MI, US· patent location history
1999Patents assigned to FORD GLOBAL TECH (1)· patent assignee history
2001–2006Patents assigned to VISTEON GLOBAL TECH INC (14)· patent assignee history
2001Patents assigned to VISTEON GLOBAL TECH (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VISTEON GLOBAL TECH INC | 14 | 2001–2006 |
| FORD MOTOR CO | 10 | 1994–2000 |
| FORD GLOBAL TECH | 1 | 1999 |
| VISTEON GLOBAL TECH | 1 | 2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dearborn, MI, US | 27 | 1994–2006 |