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Inventor

Shuichi Kamata

Inventor
Tokyo, JP

Overview

2→
Patents
2018–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing50%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
PatentTitleYear
10,926,374Substrate processing apparatus202110,029,344Polishing apparatus and polishing method2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2021Patents assigned to EBARA CORP (2)· patent assignee history
2018–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP22018–2021
Locations
LocationPatentsSpan
Tokyo, JP22018–2021