Inventor
CHIN-LUNG CHUNG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices45%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
12,550,699Integrated circuit interconnect structure having discontinuous barrier layer and air gap202612,347,776Integrated chip with graphene based interconnect202512,300,599Method for forming semiconductor structure202512,218,060Integrated chip with graphene based interconnect202512,051,643Hybrid via interconnect structure202411,978,663Integrated circuit interconnect structure having discontinuous barrier layer and air gap202411,948,837Semiconductor structure having vertical conductive graphene and method for forming the same202411,682,616Semiconductor structure and method for forming the same202311,605,558Integrated circuit interconnect structure having discontinuous barrier layer and air gap2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2023–2026 |