Inventor
HyungMin Lee
Inventor
Seoul, KR
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01LSemiconductor devices14%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
C30BSingle-crystal growth9%
G06FElectric digital data processing7%
G03HHolographic processes or apparatus5%
G06TImage data processing or generation, in general5%
H10DInorganic electric semiconductor devices5%
G02BOptical elements, systems or apparatus2%
PatentTitleYear
11,119,444Slim backlight unit for holographic display device and holographic display device including the same202111,073,794Holographic display apparatus and method for providing expanded viewing window202110,793,969Sample rod growth and resistivity measurement during single crystal silicon ingot production202010,781,532Methods for determining the resistivity of a polycrystalline silicon melt202010,513,796Methods for producing low oxygen silicon ingots2019D0853398Electronic cover with light animation201910,043,488Electronic device and method of controlling display thereof20189,951,440Methods for producing low oxygen silicon ingots20189,898,096'Electronic device and method of controlling display of screen thereof'20189,594,473'Sound visualization method and apparatus of electronic device'20179,391,046'Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer'20169,305,897'Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate'20169,190,297'Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures'20159,153,476'Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die'20158,710,668'Integrated circuit packaging system with laser hole and method of manufacture thereof'20148,710,634'Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof'20148,648,469'Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate'20148,426,955'Integrated circuit packaging system with a stack package and method of manufacture thereof'20138,357,564'Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die'20138,008,121'Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2016Patents assigned to STATS CHIPPAC LTD (9)· patent assignee history
2011–2016Based in Gyeonggi-do, KR· patent location history
2013–2016Patents assigned to LEE HYUNGMIN (7)· patent assignee history
2013–2016Patents assigned to CHI HEEJO (5)· patent assignee history
2013–2015Patents assigned to PARK YEONGIM (4)· patent assignee history
2013–2014Based in Bucheon-si, KR· patent location history
2017–2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2017–2021Based in Seoul, KR· patent location history
2018–2019Based in Cheonan, SK· patent location history
2020Based in Cheonan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 9 | 2011–2016 |
| LEE HYUNGMINself | 7 | 2013–2016 |
| SAMSUNG ELECTRONICS CO LTD | 6 | 2017–2021 |
| CHI HEEJO | 5 | 2013–2016 |
| PARK YEONGIM | 4 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 6 | 2017–2021 |
| Gyeonggi-do, KR | 6 | 2011–2016 |
| Bucheon-si, KR | 3 | 2013–2014 |
| Cheonan-si, KR | 2 | 2020 |
| Cheonan, SK | 2 | 2018–2019 |