Inventor
PEI-HAW TSAO
Inventor
TW
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H05KPrinted circuits13%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers4%
C09JAdhesives4%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials3%
PatentTitleYear
12,568,866Semiconductor structure and method of manufacturing the same202612,463,192Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier202512,417,993Chip structure202512,347,817Semiconductor device package having warpage control202512,261,125Method for forming chip package structure202512,237,226Dicing method for stacked semiconductor devices202512,230,593Wafer level package with polymer layer delamination prevention design and method of forming the same202512,205,859Package and printed circuit board attachment202512,159,847Integrated fan-out structures and methods for forming the same202412,051,624Stacked semiconductor devices and methods of forming thereof202412,016,126Carrier tape system and components and methods of use202411,990,423Magnetic shielding material with insulator-coated ferromagnetic particles202411,978,729Semiconductor device package having warpage control and method of forming the same202411,894,331Chip package structure, chip structure and method for forming chip structure202411,804,445Method for forming chip package structure202311,798,860Semiconductor structure and manufacturing method thereof202311,725,120Carrier tape system and methods of making and using the same202311,610,827Package and printed circuit board attachment202311,527,499Integrated fan-out structures and methods for forming the same202211,495,556Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same202211,404,383Magnetic shielding material with insulator-coated ferromagnetic particles202211,240,947Carrier tape system and components and methods of use202211,239,143Semiconductor structure and manufacturing method thereof202211,164,764Carrier tape system and methods of using carrier tape system202111,164,763Carrier tape system and methods of using carrier tape system2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (25)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 25 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 25 | 2021–2026 |