Inventor

Ken M. Lam

Inventor

Colorado Springs, CO, US

Overview

1986–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 55 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1051%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

Y10TTechnical subjects covered by former us classification10%

H05KPrinted circuits6%

G01RMeasuring electric variables3%

A61BDiagnosis2%

H01FMagnets2%

H01LSemiconductor devices2%

H01RElectrically-conductive connections2%

Y02PClimate change mitigation technologies in the production or processing of goods2%

PatentTitleYear

9,905,498'Electronic package'2018 9,704,812'Double-sided electronic package'2017 9,649,054'Blood pressure measurement method'2017 9,532,722'Patient monitoring system'2017 8,860,195'Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package'2014 8,568,822'Apparatus and method incorporating discrete passive components in an electronic package'2013 8,531,022'Routable array metal integrated circuit package'2013 8,525,329'Component stacking for integrated circuit electronic package'2013 8,487,424'Routable array metal integrated circuit package fabricated using partial etching process'2013 8,455,304'Routable array metal integrated circuit package fabricated using partial etching process'2013 8,429,814'Method of assembling a multi-component electronic package'2013 8,324,023'Stacked-die electronics package with planar and three-dimensional inductor elements'2012 8,278,150'Stackable packages for three-dimensional packaging of semiconductor dice'2012 8,264,075'Stacked-die package including substrate-ground coupling'2012 8,258,599'Electronics package with an integrated circuit device having post wafer fabrication integrated passive components'2012 8,237,266'Component stacking for integrated circuit electronic package'2012 8,174,099'Leadless package with internally extended package leads'2012 8,044,526'Integrated circuit assemblies with alignment features and devices and methods related thereto'2011 8,022,516'Metal leadframe package with secure feature'2011 8,018,065'Wafer-level integrated circuit package with top and bottom side electrical connections'2011 7,981,796'Methods for forming packaged products'2011 7,932,590'Stacked-die electronics package with planar and three-dimensional inductor elements'2011 7,927,918'Packaged products, including stacked package modules, and methods of forming same'2011 7,880,193'Method for forming an integral electromagnetic radiation shield in an electronic package'2011 7,838,971'Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages'2010 7,821,122'Method and system for increasing circuitry interconnection and component capacity in a multi-component package'2010 7,816,769'Stackable packages for three-dimensional packaging of semiconductor dice'2010 7,678,618'Methods using die attach paddle for mounting integrated circuit die'2010 7,638,862'Die attach paddle for mounting integrated circuit die'2009 7,626,247'Electronic package with integral electromagnetic radiation shield and methods related thereto'2009 7,564,137'Stackable integrated circuit structures and systems devices and methods related thereto'2009 7,342,308'Component stacking for integrated circuit electronic package'2008 7,327,030'Apparatus and method incorporating discrete passive components in an electronic package'2008 7,323,765'Die attach paddle for mounting integrated circuit die'2008 7,271,031'Universal interconnect die'2007 7,239,976'Method and system for automatic pointing stabilization and aiming control device'2007 7,239,975'Method and system for automatic stabilization and pointing control of a device'2007 7,078,792'Universal interconnect die'2006 7,064,434'Customized microelectronic device and method for making customized electrical interconnections'2006 6,972,486'Low profile carrier for non-wafer form device testing'2005 6,762,117'Method of fabricating metal redistribution layer having solderable pads and wire bondable pads'2004 6,577,008'Metal redistribution layer having solderable pads and wire bondable pads'2003 6,541,284'Integrated IC chip package for electronic image sensor die'2003 6,511,901'Metal redistribution layer having solderable pads and wire bondable pads'2003 6,413,799'Method of forming a ball-grid array package at a wafer level'2002 6,388,335'Integrated circuit package formed at a wafer level'2002 6,376,914'Dual-die integrated circuit package'2002 6,344,401'Method of forming a stacked-die integrated circuit chip package on a water level'2002 6,281,046'Method of forming an integrated circuit package at a wafer level'2001 5,612,514'Tab test device for area array interconnected chips'1997 5,367,763'TAB testing of area array interconnected chips'1994 5,249,728'Bumpless bonding process having multilayer metallization'1993 5,216,806'Method of forming a chip package and package interconnects'1993 5,177,863'Method of forming integrated leadouts for a chip carrier'1993 4,612,227'Pressure sensor header'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1986–2018Based in Colorado Springs, CO, US· patent location history

1993–2018Patents assigned to ATMEL CORP (50)· patent assignee history

2007Patents assigned to AMERICAN GNC CORP (2)· patent assignee history

2007Based in Picatinny Arsenal, NJ, US· patent location history

2012–2014Patents assigned to LAM KEN M (8)· patent assignee history

2012–2017Patents assigned to LAM KEN (7)· patent assignee history

2017Patents assigned to DALVI CRISTIANO (2)· patent assignee history

2017Based in Walnut, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ATMEL CORP	50	1993–2018
LAM KEN Mself	8	2012–2014
LAM KENself	7	2012–2017
AMERICAN GNC CORP	2	2007
DALVI CRISTIANO	2	2017

Locations

Location	Patents	Span
Colorado Springs, CO, US	51	1986–2018
Walnut, California, US	2	2017
Picatinny Arsenal, New Jersey, US	2	2007