Inventor
Scott Chin
Inventor
Palo Alto, CA, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing100%
PatentTitleYear
7,311,586'Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20077,044,838'Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring'20067,029,382'Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20066,368,189'Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure'20026,309,290'Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control'20016,231,428'Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2002Patents assigned to MITSUBISHI MATERIALS CORP (3)· patent assignee history
2001–2007Based in Palo Alto, CA, US· patent location history
2006–2007Patents assigned to EBARA CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 3 | 2006–2007 |
| MITSUBISHI MATERIALS CORP | 3 | 2001–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palo Alto, California, US | 6 | 2001–2007 |