Inventor
Andrew Douglas Delano
Inventor
Woodinville, WA, US
Overview
Patents· 38 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H05KPrinted circuits15%
H01LSemiconductor devices7%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact7%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
F04DNon-positive-displacement pumps3%
B23KSoldering or unsoldering2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light2%
PatentTitleYear
10,798,848Passive thermal management system with phase change material202010,698,458Integrated vapor chamber for thermal management of computing devices202010,678,314Dynamic thermal management for optimal battery charging202010,656,688Thermal management system including an elastically deformable phase change device202010,649,506Thermal dock for a mobile computing device202010,503,220Viscous flow blower for thermal management of an electronic device201910,488,873Monitoring surface temperature of devices201910,451,356Lost wax cast vapor chamber device201910,429,908Black body radiation in a computing device201910,386,898Thermal dock for a mobile computing device201910,321,615Display module with integrated thermal management structure201910,248,172Spectrally selective radiation emission device201910,054,995Additive manufactured passive thermal enclosure201810,037,062Thermal venting device with pressurized plenum20189,823,718'Device cooling'20179,803,125'Thermal interface material and method of making and using the same'20179,746,888'Uniform flow heat sink'20179,733,680'Thermal management system including an elastically deformable phase change device'20179,710,026'Computing device heat management'20179,665,138'Micro-hole vents for device ventilation systems'20179,639,125'Centrifugal fan with integrated thermal transfer unit'20179,618,945'Monitoring surface temperature of devices'20179,353,304'Thermal interface material and method of making and using the same'20169,329,647'Computing device having a spectrally selective radiation emission device'20169,311,909'Sensed sound level based fan speed adjustment'20168,020,608'Heat sink fin with stator blade'20117,480,143'Variable-gap thermal-interface device'20097,344,384'Bolster plate assembly for processor module assembly'20087,120,023'Method of assembly of a wedge thermal interface to allow expansion after assembly'20066,985,359'Variable-wedge thermal-interface device'20066,945,313'Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly'20056,868,899'Variable height thermal interface'20056,807,057'Apparatus and method for cooling an electronic device'20046,702,001'Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly'20046,638,641'Friction welding with conoids'20036,327,148'Heatsink for actively cooled daughterboard system'20016,304,442'Actively cooled daughterboard system'20016,295,202'Heatsink for actively cooled daughterboard system'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001Patents assigned to HEWLETT PACKARD CO (3)· patent assignee history
2001–2011Based in Fort Collins, CO, US· patent location history
2003–2005Patents assigned to AGILENT TECHNOLOGIES INC (3)· patent assignee history
2004–2011Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (7)· patent assignee history
2016–2020Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (23)· patent assignee history
2016–2017Patents assigned to HONEYWELL INT INC (2)· patent assignee history
2016–2020Based in Woodinville, WA, US· patent location history
2016–2017Based in Spokane Valley, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICROSOFT TECHNOLOGY LICENSING LLC | 23 | 2016–2020 |
| HEWLETT PACKARD DEVELOPMENT CO | 7 | 2004–2011 |
| AGILENT TECHNOLOGIES INC | 3 | 2003–2005 |
| HEWLETT PACKARD CO | 3 | 2001 |
| HONEYWELL INT INC | 2 | 2016–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Woodinville, Washington, US | 23 | 2016–2020 |
| Fort Collins, CO, US | 13 | 2001–2011 |
| Spokane Valley, Washington, US | 2 | 2016–2017 |