Inventor

Robert J. Wojnarowski

Inventor

Ballston Lake, NY, US

Overview

1981–2012

Patent span

Electricity

Primary field (CPC H)

Patents· 145 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%

H05KPrinted circuits12%

Y10TTechnical subjects covered by former us classification12%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

H01CResistors3%

H10HInorganic light-emitting semiconductor devices having potential barriers3%

G01RMeasuring electric variables2%

G01MTesting static or dynamic balance of machines or structures1%

G02BOptical elements, systems or apparatus1%

PatentTitleYear

8,294,597'Self regulating power conditioner for energy harvesting applications'2012 8,098,143'Power aware techniques for energy harvesting remote sensor system'2012 7,829,386'Power semiconductor packaging method and structure'2010 7,696,676'Piezoelectric composite apparatus and related methods'2010 7,683,391'UV emitting LED having mesa structure'2010 7,667,375'Broad band energy harvesting system and related methods'2010 7,572,973'Method of making devices for solid state thermal transfer and power generation'2009 7,558,701'System to monitor the health of a structure, sensor nodes, program product, and related methods'2009 7,527,742'Etchant, method of etching, laminate formed thereby, and device'2009 7,498,507'Device for solid state thermal transfer and power generation'2009 7,482,634'Monolithic array for solid state ultraviolet light emitters'2009 7,276,703'System to monitor the health of a structure, sensor nodes, program product, and related methods'2007 7,262,444'Power semiconductor packaging method and structure'2007 7,005,648'Direct CsI scintillator coating for improved digital X-ray detector assembly longevity'2006 6,890,234'LED cross-linkable phosphor coating'2005 6,883,926'Light emitting semi-conductor device apparatus for display illumination'2005 6,747,406'LED cross-linkable phospor coating'2004 6,720,561'Direct CsI scintillator coating for improved digital X-ray detector assembly longevity'2004 6,655,011'Method for fabricating a switch structure'2003 6,635,987'High power white LED lamp structure using unique phosphor application for LED lighting products'2003 6,635,363'Phosphor coating with self-adjusting distance from LED chip'2003 6,604,971'Fabrication of LED lamps by controlled deposition of a suspension media'2003 6,603,145'High temperature circuit apparatus'2003 6,507,113'Electronic interface structures and methods of fabrication'2003 6,483,196'Flip chip led apparatus'2002 6,474,860'Alignment of optical interfaces for data communication'2002 6,461,696'Multi-layered polymer based moisture barrier structure for medical grade products'2002 6,452,217'High power LED lamp structure using phase change cooling enhancements for LED lighting products'2002 6,429,381'High density interconnect multichip module stack and fabrication method'2002 6,412,971'Light source including an array of light emitting semiconductor devices and control method'2002 6,410,356'Silicon carbide large area device fabrication apparatus and method'2002 6,407,411'Led lead frame assembly'2002 6,396,153'Circuit chip package and fabrication method'2002 6,302,987'High voltage polymer processing methods and power feed-through bushing applications'2001 6,303,200'Low modulus and autoclavable monolayer medical tubing'2001 6,298,551'Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas'2001 6,297,459'Processing low dielectric constant materials for high speed electronics'2001 6,272,271'Alignment of optical interfaces for data communication'2001 6,262,573'Electromagnetic system for railroad track crack detection and traction enhancement'2001 6,242,282'Circuit chip package and fabrication method'2001 6,229,203'Semiconductor interconnect structure for high temperature applications'2001 6,188,301'Switching structure and method of fabrication'2001 6,092,280'Flexible interface structures for electronic devices'2000 6,046,410'Interface structures for electronic devices'2000 6,040,226'Method for fabricating a thin film inductor'2000 6,002,163'Electronic device pad relocation, precision placement, and packaging in arrays'1999 5,949,133'Semiconductor interconnect structure for high temperature applications'1999 5,938,452'Flexible interface structures for electronic devices'1999 5,900,674'Interface structures for electronic devices'1999 5,897,728'Integrated circuit test structure and test process'1999 5,888,884'Electronic device pad relocation, precision placement, and packaging in arrays'1999 5,872,040'Method for fabricating a thin film capacitor'1999 5,866,952'High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate'1999 5,857,858'Demountable and repairable low pitch interconnect for stacked multichip modules'1999 5,849,623'Method of forming thin film resistors on organic surfaces'1998 5,785,787'Processing low dielectric constant materials for high speed electronics'1998 5,737,458'Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography'1998 5,703,400'Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers'1997 5,683,928'Method for fabricating a thin film resistor'1997 5,675,310'Thin film resistors on organic surfaces'1997 5,672,546'Semiconductor interconnect method and structure for high temperature applications'1997 5,576,517'Low Dielectric constant materials for high speed electronics'1996 5,567,657'Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers'1996 5,562,838'Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography'1996 5,554,305'Processing low dielectric constant materials for high speed electronics'1996 5,546,654'Vacuum fixture and method for fabricating electronic assemblies'1996 5,527,741'Fabrication and structures of circuit modules with flexible interconnect layers'1996 5,525,190'Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography'1996 5,452,182'Flexible high density interconnect structure and flexibly interconnected system'1995 5,449,427'Processing low dielectric constant materials for high speed electronics'1995 5,434,751'Reworkable high density interconnect structure incorporating a release layer'1995 5,422,513'Integrated circuit chip placement in a high density interconnect structure'1995 5,391,516'Method for enhancement of semiconductor device contact pads'1995 5,381,445'Munitions cartridge transmitter'1995 5,366,906'Wafer level integration and testing'1994 5,359,496'Hermetic high density interconnected electronic system'1994 5,357,403'Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns'1994 5,353,498'Method for fabricating an integrated circuit module'1994 5,355,102'HDI impedance matched microwave circuit assembly'1994 5,353,195'Integral power and ground structure for multi-chip modules'1994 5,348,607'High density interconnect thermoplastic die attach material and solvent die attach processing'1994 5,336,928'Hermetically sealed packaged electronic system'1994 5,331,203'High density interconnect structure including a chamber'1994 5,324,687'Method for thinning of integrated circuit chips for lightweight packaged electronic systems'1994 5,302,547'Systems for patterning dielectrics by laser ablation'1994 5,258,647'Electronic systems disposed in a high force environment'1993 5,241,456'Compact high density interconnect structure'1993 5,225,023'High density interconnect thermoplastic die attach material and solvent die attach processing'1993 5,214,655'Integrated circuit packaging configuration for rapid customized design and unique test capability'1993 5,200,810'High density interconnect structure with top mounted components'1993 5,169,678'Laser ablatable polymer dielectrics and methods'1992 5,161,093'Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive'1992 5,157,589'Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G \' s'1992 5,154,793'Method and apparatus for removing components bonded to a substrate'1992 5,151,776'Die attachment method for use in high density interconnected assemblies'1992 5,144,407'Semiconductor chip protection layer and protected chip'1992 5,107,586'Method for interconnecting a stack of integrated circuits at a very high density'1992 5,108,825'Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it'1992 5,104,480'Direct patterning of metals over a thermally inefficient surface using a laser'1992 5,094,709'Apparatus for packaging integrated circuit chips employing a polymer film overlay layer'1992 5,019,946'High density interconnect with high volumetric efficiency'1991 5,019,535'Die attachment method using nonconductive adhesive for use in high density interconnected assemblies'1991 5,018,150'Reflector switched lasers'1991 4,937,203'Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer'1990 4,933,042'Method for packaging integrated circuit chips employing a polymer film overlay layer'1990 4,918,811'Multichip integrated circuit packaging method'1990 4,901,136'Multi-chip interconnection package'1990 4,894,115'Laser beam scanning method for forming via holes in polymer materials'1990 4,884,122'Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer'1989 4,878,991'Simplified method for repair of high density interconnect circuits'1989 4,866,508'Integrated circuit packaging configuration for rapid customized design and unique test capability'1989 4,842,677'Excimer laser patterning of a novel resist using masked and maskless process steps'1989 4,835,704'Adaptive lithography system to provide high density interconnect'1989 4,783,695'Multichip integrated circuit packaging configuration and method'1988 4,780,177'Excimer laser patterning of a novel resist'1988 4,770,921'Self-shielding multi-layer circuit boards'1988 4,714,516'Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging'1987 4,646,149'Alternate field luminance enhancement in a spectrum conserving television system'1987 4,646,135'System for allowing two television programs simultaneously to use the normal bandwidth for one program by chrominance time compression and luminance bandwidth reduction'1987 4,646,151'Television frame synchronizer with independently controllable input/output rates'1987 4,646,152'Sharpness enhanced equal bandwidth luminance bandwidth compression system'1987 4,571,322'Method for providing insulated holes in conducting substrate'1986 4,528,748'Method for fabricating a printed circuit board of desired shape'1985 4,522,888'Electrical conductors arranged in multiple layers'1985 4,495,251'Shielded plastic microwave oven cavity'1985 4,487,811'Electrical conductor'1984 4,481,404'Turn-off control circuit for self-cleaning ovens'1984 4,470,883'Additive printed circuit process'1984 4,466,850'Method for fabricating a one-time electrically activated switch'1984 4,441,015'Cooking apparatus employing a rotisserie mode with stationary food'1984 4,438,158'Method for fabrication of electrical resistor'1984 4,438,291'Screen-printable thermocouples'1984 4,430,557'Cooking apparatus having internal pressurizing source and _integral heat source _'1984 4,416,914'Electrical conductors arranged in multiple layers and preparation thereof'1983 4,404,237'Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal'1983 4,385,082'Preparation of shielded plastic microwave oven'1983 4,380,749'One-time electrically-activated switch'1983 4,377,505'Electrical resistor and fabrication thereof'1983 4,362,903'Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells'1982 4,345,236'Abrasion-resistant screen-printed potentiometer'1982 4,301,509'Method for cooking meat or poultry in thermal oven'1981 4,298,789'Oven having a cavity heated by at least one monolithic integrated heat source'1981 4,296,296'Controllable-duty-cycle power supply for microwave oven magnetron and the like'1981 4,290,052'Capacitive touch entry apparatus having high degree of personal safety'1981 4,268,779'Circuit for controlling current flow from an A.C. source to a load'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1981–2010Patents assigned to GEN ELECTRIC (122)· patent assignee history

1981–1985Based in Clifton Park, NY, US· patent location history

1984–2012Based in Ballston Lake, NY, US· patent location history

1994–1998Patents assigned to MARTIN MARIETTA CORP (9)· patent assignee history

1999–2012Patents assigned to LOCKHEED CORP (10)· patent assignee history

2001–2002Patents assigned to BAXTER INT (2)· patent assignee history

2001–2002Based in Zion, IL, US· patent location history

2012Patents assigned to ANDARAWIS EMAD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GEN ELECTRIC	122	1981–2010
LOCKHEED CORP	10	1999–2012
MARTIN MARIETTA CORP	9	1994–1998
ANDARAWIS EMAD	2	2012
BAXTER INT	2	2001–2002

Locations

Location	Patents	Span
Ballston Lake, New York, US	125	1984–2012
Clifton Park, New York, US	18	1981–1985
Zion, Illinois, US	2	2001–2002