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Inventor

Shih-Wen Huang

Inventor
Tainan, TW

Overview

24→
Patents
1999–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms10%
G01NInvestigating or analysing materials by determining their chemical or physical properties10%
H10DInorganic electric semiconductor devices10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
C23CCoating metallic material3%
H01JElectric discharge tubes or discharge lamps3%
B01DSeparation1%
PatentTitleYear
10,777,466Semiconductor Fin cutting process and structures formed thereby202010,741,366Process chamber and wafer processing method202010,720,430Forming doped regions in semiconductor strips202010,629,693Semiconductor structure with barrier layer and method for forming the same202010,522,541Forming doped regions in semiconductor strips201910,276,677Semiconductor device structure and method for forming the same201910,269,796Forming doped regions in semiconductor strips201910,262,939Configurable routing for packaging applications201910,008,367Gas diffuser unit, process chamber and wafer processing method20189,978,637Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)20189,881,918'Forming doped regions in semiconductor strips'20189,711,478'Semiconductor device with an anti-pad peeling structure and associated method'20179,627,223'Methods and apparatus of packaging with interposers'20179,530,730'Configurable routing for packaging applications'20169,305,808'Methods and apparatus of packaging with interposers'20169,064,705'Methods and apparatus of packaging with interposers'20158,119,853'Low pressure acetylene storage'20127,270,974'Rapid diagnostic method for detecting bacterial sinusitis'20076,967,084'Kit for rapidly diagnosing upper respiratory conditions'20056,951,730'Method for rapidly diagnosing upper respiratory conditions'20056,855,491'Device for rapidly diagnosing upper respiratory conditions'20056,764,849'Rapid diagnostic method for distinguishing allergies and infections and nasal secretion collection unit'20046,551,791'Rapid diagnostic method for distinguishing allergies and infections and nasal secretion collection unit'20035,910,421'Rapid diagnostic method for distinguishing allergies and infections'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2007Patents assigned to UNIV FLORIDA (5)· patent assignee history
1999–2007Based in Gainesville, FL, US· patent location history
2012Patents assigned to HUANG SHIH-WEN (1)· patent assignee history
2012Patents assigned to L AIR LIQUIDE SOCIETEANONYME POUR L ETUDE ET L EXPL DES PROCEDES GEORGES CLAUDE (1)· patent assignee history
2012Based in Paris, FR· patent location history
2015–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2015–2019Based in Shuishang Township, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2017Based in Chiayi County, TW· patent location history
2018–2020Based in Tainan, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD142016–2020
UNIV FLORIDA51999–2007
TAIWAN SEMICONDUCTOR MFG22015–2016
HUANG SHIH-WENself12012
L AIR LIQUIDE SOCIETEANONYME POUR L ETUDE ET L EXPL DES PROCEDES GEORGES CLAUDE12012
Locations
LocationPatentsSpan
Tainan, TW92018–2020
Gainesville, Florida, US71999–2007
Shuishang Township, TW62015–2019
Chiayi County, TW12017
Paris, FR12012