Inventor
OLIVER BLANK
Inventor
AT
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices35%
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10NElectric solid-state devices not otherwise provided for3%
G01RMeasuring electric variables2%
H03KPulse technique2%
PatentTitleYear
12,557,333Semiconductor power device and method of manufacturing the same202612,471,324Power semiconductor device having an electrode with an embedded material202512,431,886Electronic circuit with a transistor device and a clamp circuit and method202512,414,349Semiconductor die including an edge termination structure laterally between an active area and a lateral edge region of the die202512,349,400Edge termination structure for power transistor devices202512,336,255Semiconductor die having a sodium stopper in an insulation layer groove and method of manufacturing the same202512,166,080Semiconductor transistor device having a titled body contact area and method of manufacturing the same202412,080,789Semiconductor die and method of manufacturing the same202412,046,563Semiconductor wafer having an auxiliary structure positioned in a scribe line region, semiconductor chip and method of fabricating a semiconductor wafer202411,973,016Semiconductor device202411,876,041Semiconductor device having a metallization structure202411,862,692Contact structure for transistor devices202411,728,427Power semiconductor device having a strain-inducing material embedded in an electrode202311,721,638Optically detectable reference feature for processing a semiconductor wafer202311,699,725Semiconductor device having an alignment layer with mask pits202311,699,726Semiconductor die and method of manufacturing the same202311,670,684Semiconductor transistor device and method of manufacturing the same202311,616,032Semiconductor device having alignment pads and method of manufacturing the same202311,462,620Semiconductor device having a transistor cell region and a termination region with needle-shaped field plate structures202211,362,184Contact structure for power semiconductor devices202211,270,948Semiconductor wafer, semiconductor chip and method of fabricating a semiconductor wafer202211,251,275Needle cell trench MOSFET202211,239,147Semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (22)· patent assignee history
2022–2026Based in AT· patent location history
2023Patents assigned to INFINEON TECHNOLOGIES AG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AUSTRIA AG | 22 | 2022–2026 |
| INFINEON TECHNOLOGIES AG | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| AT | 23 | 2022–2026 |