Inventor

Takayuki Morino

Inventor
Yamato, JP

Overview

14→
Patents
2002–2021
Patent span
Physics
Primary field (CPC G)

Patents· 14 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing36%
H05KPrinted circuits14%
B29CShaping or joining of plastics7%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%
B29LIndexing scheme associated with subclass b29c, relating to particular articles7%
H01RElectrically-conductive connections7%
F04DNon-positive-displacement pumps4%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants4%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges4%
G06KGraphical data reading4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Patents assigned to IBM (2)· patent assignee history
2002–2016Based in Yamato, JP· patent location history
2005–2021Patents assigned to LENOVO SINGAPORE PTE LTD (11)· patent assignee history
2013–2016Patents assigned to MORINO TAKAYUKI (3)· patent assignee history
2013–2016Patents assigned to JI GANG (2)· patent assignee history
2013–2016Patents assigned to OHTANI TETSUYA (2)· patent assignee history
2013–2020Based in Kanagawa, JP· patent location history
2018–2019Based in Yokohama, JP· patent location history
2021Based in Yokohama-shi, Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LENOVO SINGAPORE PTE LTD112005–2021
MORINO TAKAYUKIself32013–2016
IBM22002
JI GANG22013–2016
OHTANI TETSUYA22013–2016
Locations
LocationPatentsSpan
Yamato, JP72002–2016
Kanagawa, JP32013–2020
Yokohama-shi, Kanagawa, JP22021
Yokohama, JP22018–2019