Inventor
CHAO-I WU
Inventor
TW
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices28%
G11CStatic stores18%
H10DInorganic electric semiconductor devices17%
H01LSemiconductor devices15%
H10NElectric solid-state devices not otherwise provided for12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G06FElectric digital data processing1%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h101%
H04NPictorial communication, e.g. television1%
PatentTitleYear
12,563,736Memory device and method of forming the same202612,513,909Semiconductor structure having memory device and method of forming the same202512,513,907Method of forming memory device202512,505,871Memory cell and method of operating the same202512,484,228Semiconductor chip202512,453,105Memory chiplet having multiple arrays of memory devices and methods of forming the same202512,433,178PCRAM structure202512,374,405Memory device having interface charge traps202512,356,876Memory device and formation method thereof202512,289,892Memory device structure and manufacturing method thereof202512,201,041Memory device comprising heater of different heat conducting materials and programming method thereof202512,178,053Memory device and method of forming the same202412,170,265Semiconductor package202412,167,704Memory devices and methods of forming the same202412,143,612Context-based adaptive binary arithmetic coding decoder capable of decoding multiple bins in one cycle and associated decoding method202412,137,569Memory device and method of forming the same202412,133,390Memory array202412,114,513Memory device and manufacturing method thereof202412,106,814Method of testing a memory circuit and memory circuit202412,069,871Three-dimensional memory device and manufacturing method thereof202412,058,867Memory device202412,041,781Three-dimensional memory device with ferroelectric material202412,041,793Hybrid memory device and method of forming the same202412,040,006Memory array including dummy regions202412,029,143Memory device and programming method thereof202411,980,036Semiconductor structure having memory device and method of forming the same202411,956,968Memory device202411,895,849Memory device and method of forming the same202411,862,219Memory cell and method of operating the same202411,849,587Three-dimensional memory device and manufacturing method thereof202311,749,370Method of testing a memory circuit and memory circuit202311,744,165Memory devices and methods of forming the same202311,672,126Three-dimensional memory device and manufacturing method thereof202311,637,126Memory device and method of forming the same202311,616,080Three-dimensional memory device with ferroelectric material202311,587,950Memory device and method of forming the same202311,568,912Memory cell and method of operating the same202311,538,862Three-dimensional memory device and manufacturing method thereof202211,532,357Memory cell with temperature modulated read voltage202211,532,343Memory array including dummy regions202211,502,128Memory device and method of forming the same202211,444,126Memory device and manufacturing method thereof202211,411,011Semiconductor structure having memory device and method of forming the same202211,309,490Memory devices and methods of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (43)· patent assignee history
2022–2026Based in TW· patent location history
2024Patents assigned to MEDIATEK INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 43 | 2022–2026 |
| MEDIATEK INC | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 44 | 2022–2026 |