Inventor
Jicheng Yang
Inventor
North Andover, MA, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
B81BMicrostructural devices or systems, e.g. micromechanical devices15%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers11%
Y10TTechnical subjects covered by former us classification11%
H01LSemiconductor devices5%
LOC144%
G02BOptical elements, systems or apparatus2%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
H04SStereophonic systems2%
PatentTitleYear
D0923001Display device2021D0923000Display device20219,338,559'Microphone system with a stop member'20169,258,634'Microphone system with offset apertures'20169,142,470'Packages and methods for packaging'20159,002,040'Packages and methods for packaging MEMS microphone devices'20158,853,839'Air-release features in cavity packages'20148,779,535'Packaged integrated device die between an external and internal housing'20148,723,308'Packages and methods for packaging using a lid having multiple conductive layers'20148,577,063'Packages and methods for packaging MEMS microphone devices'20138,447,057'Packages and methods for packaging MEMS microphone devices'20137,224,070'Plurality of semiconductor die in an assembly'20077,145,253'Encapsulated sensor device'20067,078,264'Stacked semiconductor die'20066,909,167'Coupling spaced bond pads to a contact'20056,807,218'Laser module and optical subassembly'20046,759,307'Method to prevent die attach adhesive contamination in stacked chips'20046,620,648'Multi-chip module with extension'20036,580,160'Coupling spaced bond pads to a contact'20036,453,547'Coupling spaced bond pads to a contact'20026,274,930'Multi-chip module with stacked dice'20016,207,467'Multi-chip module with stacked dice'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2007Patents assigned to MICRON TECHNOLOGY INC (9)· patent assignee history
2001–2005Based in Singapore, SG· patent location history
2004–2006Patents assigned to AMKOR TECHNOLOGY INC (2)· patent assignee history
2004–2007Based in Newark, DE, US· patent location history
2006Based in Gilbert, AZ, US· patent location history
2013–2015Patents assigned to ANALOG DEVICES INC (6)· patent assignee history
2013–2014Patents assigned to YANG JICHENG (4)· patent assignee history
2013–2016Based in North Andover, MA, US· patent location history
2015–2016Patents assigned to INVENSENSE INC (3)· patent assignee history
2021Based in Ulsan, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 9 | 2001–2007 |
| ANALOG DEVICES INC | 6 | 2013–2015 |
| YANG JICHENGself | 4 | 2013–2014 |
| INVENSENSE INC | 3 | 2015–2016 |
| AMKOR TECHNOLOGY INC | 2 | 2004–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| North Andover, Massachusetts, US | 9 | 2013–2016 |
| Singapore, SG | 6 | 2001–2005 |
| Newark, Delaware, US | 3 | 2004–2007 |
| Ulsan, KR | 2 | 2021 |
| Gilbert, AZ, US | 1 | 2006 |