Inventor
Hiroyuki Takasaka
Inventor
Ibaraki, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H05KPrinted circuits18%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
PatentTitleYear
8,178,191'Multilayer wiring board and method of making the same'2012RE037323'Method for sticking an insulating film to a lead frame'20015,837,368'Insulating film with improved punching characteristics and lead frame using the same'19985,635,009'Method for sticking an insulating film to a lead frame'19975,593,774'Insulating film with improved punching characteristics and lead frame using the same'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2012Patents assigned to HITACHI CABLE (5)· patent assignee history
1997–2001Based in Ibaraki, JP· patent location history
2012Patents assigned to MATSUO NAGAYOSHI (1)· patent assignee history
2012Patents assigned to NISHINO SHIGEO (1)· patent assignee history
2012Patents assigned to OKABE HIROYUKI (1)· patent assignee history
2012Patents assigned to TAKASAKA HIROYUKI (1)· patent assignee history
2012Based in Hitachi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CABLE | 5 | 1997–2012 |
| MATSUO NAGAYOSHI | 1 | 2012 |
| NISHINO SHIGEO | 1 | 2012 |
| OKABE HIROYUKI | 1 | 2012 |
| TAKASAKA HIROYUKIself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 4 | 1997–2001 |
| Hitachi, JP | 1 | 2012 |