Inventor
BOHAN SHAN
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium8%
C25BElectrolytic or electrophoretic processes for the production of compounds or non-metals8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
PatentTitleYear
12,412,868Microelectronic assemblies including interconnects with different solder materials202512,354,883Omni directional interconnect with magnetic fillers in mold matrix202512,119,326Microelectronic structures including bridges202412,033,930Selectively roughened copper architectures for low insertion loss conductive features202411,753,731Two-dimensional metal-organic framework alloy photocatalysts2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023Patents assigned to MU BIN (1)· patent assignee history
2023Patents assigned to SHAN BOHAN (1)· patent assignee history
2023Patents assigned to SHEN YUXIA (1)· patent assignee history
2023Patents assigned to TONGAY SEFAATTIN (1)· patent assignee history
2023–2025Based in US· patent location history
2024–2025Patents assigned to INTEL CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2024–2025 |
| MU BIN | 1 | 2023 |
| SHAN BOHANself | 1 | 2023 |
| SHEN YUXIA | 1 | 2023 |
| TONGAY SEFAATTIN | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2023–2025 |