Inventor
Herbert Reichl
Inventor
Berlin, DE
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B23KSoldering or unsoldering27%
G03CPhotosensitive materials for photographic purposes7%
G08CTransmission systems for measured values, control or similar signals7%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light7%
H04BTransmission7%
H04QSelecting7%
H05KPrinted circuits7%
PatentTitleYear
8,120,511'Stand-alone miniaturized communication module'20128,020,746'Method and device for controlling the generation of ultrasonic wire bonds'20116,478,906'Method for bonding a flexible substrate to a chip'20026,197,387'Method to prepare the production of structured metal coatings using proteins'20016,160,218'Chip housing'20005,959,352'Chip arrangement and method of producing the same'19995,833,128'Flux-free contacting of components'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2012Patents assigned to FRAUNHOFER GES FORSCHUNG (7)· patent assignee history
1998–2012Based in Berlin, DE· patent location history
2001Patents assigned to ATOTECH DEUTSCHLAND GMBH (1)· patent assignee history
2011Patents assigned to UNIV BERLIN TECH (1)· patent assignee history
2012Patents assigned to LANG KLAUS (1)· patent assignee history
2012Patents assigned to REICHL HERBERT (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FRAUNHOFER GES FORSCHUNG | 7 | 1998–2012 |
| ATOTECH DEUTSCHLAND GMBH | 1 | 2001 |
| LANG KLAUS | 1 | 2012 |
| REICHL HERBERTself | 1 | 2012 |
| UNIV BERLIN TECH | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Berlin, DE | 7 | 1998–2012 |