Inventor

Gregory B. Hotchkiss

Inventor
Richardson, TX, US

Overview

19→
Patents
1991–2004
Patent span
Electricity
Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation14%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution14%
H05KPrinted circuits12%
Y02PClimate change mitigation technologies in the production or processing of goods12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23KSoldering or unsoldering6%
Y10TTechnical subjects covered by former us classification4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C23FNon-mechanical removal of metallic material from surface2%
PatentTitleYear
6,723,629'Method and apparatus for attaching solder members to a substrate'20046,586,839'Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers'20036,432,744'Wafer-scale assembly of chip-size packages'20026,365,958'Sacrificial structures for arresting insulator cracks in semiconductor devices'20026,303,407'Method for the transfer of flux coated particles to a substrate'20016,245,583'Low stress method and apparatus of underfilling flip-chip electronic devices'20016,239,013'Method for transferring particles from an adhesive sheet to a substrate'20016,204,094'Method and apparatus for populating an adhesive sheet with particles'20016,107,606'Method and apparatus for measuring temperatures during electronic package assembly'20006,071,801'Method and apparatus for the attachment of particles to a substrate'20005,909,634'Method and apparatus for forming solder on a substrate'19995,498,576'Method and apparatus for affixing spheres to a foil matrix'19965,486,494'Method and apparatus for affixing spheres to a conductive sheet'19965,419,782'Array of solar cells having an optically self-aligning, output-increasing, ambient-protecting coating'19955,278,097'Method of making doped silicon spheres'19945,192,400'Method of isolating shorted silicon spheres'19935,091,319'Method of affixing silicon spheres to a foil matrix'19925,028,546'Method for manufacture of solar cell with foil contact point'19914,992,138'Method and apparatus for constructing a foil matrix for a solar cell'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2004Patents assigned to TEXAS INSTRUMENTS INC (18)· patent assignee history
1991–2004Based in Richardson, TX, US· patent location history
1991Based in Dallas, TX, US· patent location history
1992Patents assigned to HOTCHKISS GREGORY B (1)· patent assignee history
1992Patents assigned to JENSEN MILLARD J (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEXAS INSTRUMENTS INC181991–2004
HOTCHKISS GREGORY Bself11992
JENSEN MILLARD J11992
Locations
LocationPatentsSpan
Richardson, Texas, US181991–2004
Dallas, Texas, US11991