Inventor

HAILING LIU

Inventor

Overview

3→

Patents

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering22%

H01RElectrically-conductive connections22%

B22FWorking metallic powder11%

H01LSemiconductor devices11%

H10BElectronic memory devices11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

Y02PClimate change mitigation technologies in the production or processing of goods11%

PatentTitleYear

12,543,521Methods of forming memory device with reduced resistivity2026 11,283,2083D printed high resolution electrical connectors with novel material removal features2022 11,196,210Circular connector with integral coupling ring2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to TE Connectivity Services Gmbh (2)· patent assignee history

2021–2026Based in US· patent location history

2026Patents assigned to APPLIED MATERIALS INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TE Connectivity Services Gmbh	2	2021–2022
APPLIED MATERIALS INC	1	2026

Locations

Location	Patents	Span
US	3	2021–2026