Inventor
Hyungsuk Alexander Yoon
Inventor
San Jose, CA, US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
C23CCoating metallic material13%
H01LSemiconductor devices8%
H10DInorganic electric semiconductor devices7%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
B08BCleaning in general3%
H01JElectric discharge tubes or discharge lamps2%
H05HPlasma technique2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,535,514Method of sealing open pores on surface of porous dielectric material using iCVD process20209,911,660'Methods for forming germanium and silicon germanium nanowire devices'20189,472,675'Method of manufacturing n-doped graphene and electrical component using NH4F, and graphene and electrical component thereby'20169,359,673'Apparatus and method for atomic layer deposition'20169,117,860'Controlled ambient system for interface engineering'20158,926,789'Apparatus for the removal of a fluorinated polymer from a substrate'20158,916,232'Method for barrier interface preparation of copper interconnect'20148,883,027'Methods for removing a metal oxide from a substrate'20148,673,769'Methods and apparatuses for three dimensional integrated circuits'20148,673,779'Interconnect with self-formed barrier'20148,623,456'Methods for atomic layer deposition'20148,519,461'Device with post-contact back end of line through-hole via integration'20138,323,460'Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal'20128,298,433'Methods for removing an edge polymer from a substrate'20128,287,647'Apparatus and method for atomic layer deposition'20128,241,701'Processes and systems for engineering a barrier surface for copper deposition'20128,187,968'Methods of post-contact back end of line through-hole via integration'20128,127,395'Apparatus for isolated bevel edge clean and method for using the same'20128,058,164'Methods of fabricating electronic devices using direct copper plating'20118,053,355'Methods and systems for low interfacial oxide contact between barrier and copper metallization'20118,026,605'Interconnect structure and method of manufacturing a damascene structure'20117,863,179'Methods of fabricating a barrier layer with varying composition for copper metallization'20117,749,893'Methods and systems for low interfacial oxide contact between barrier and copper metallization'20107,691,278'Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor'20107,662,253'Apparatus for the removal of a metal oxide from a substrate and methods therefor'20107,651,585'Apparatus for the removal of an edge polymer from a substrate and methods therefor'20107,615,486'Apparatus and method for integrated surface treatment and deposition for copper interconnect'20097,615,480'Methods of post-contact back end of the line through-hole via integration'20097,540,935'Plasma oxidation and removal of oxidized material'20097,396,565'Multiple precursor cyclical deposition system'20086,958,296'CVD TiSiN barrier for copper integration'20056,846,516'Multiple precursor cyclical deposition system'20056,827,978'Deposition of tungsten films'20046,809,026'Selective deposition of a barrier layer on a metal film'20046,596,643'CVD TiSiN barrier for copper integration'20036,218,301'Deposition of tungsten films from W(CO)6'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2008Patents assigned to APPLIED MATERIALS INC (7)· patent assignee history
2001–2008Based in Santa Clara, CA, US· patent location history
2004–2020Based in San Jose, CA, US· patent location history
2009–2020Patents assigned to LAM RES CORP (29)· patent assignee history
2010–2012Based in Fremont, CA, US· patent location history
2011–2016Patents assigned to YOON HYUNGSUK ALEXANDER (15)· patent assignee history
2012–2016Patents assigned to DORDI YEZDI (11)· patent assignee history
2012–2015Patents assigned to BOYD JOHN (8)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 29 | 2009–2020 |
| YOON HYUNGSUK ALEXANDERself | 15 | 2011–2016 |
| DORDI YEZDI | 11 | 2012–2016 |
| BOYD JOHN | 8 | 2012–2015 |
| APPLIED MATERIALS INC | 7 | 2001–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 28 | 2004–2020 |
| Santa Clara, California, US | 6 | 2001–2008 |
| Fremont, California, US | 2 | 2010–2012 |