Inventor
Volker Lehmann
Inventor
Munich, DE
Overview
Patents· 83 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Hprimary
H01HElectric switches17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10DInorganic electric semiconductor devices8%
H10BElectronic memory devices7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
B82YSpecific uses or applications of nanostructures4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
Y10TTechnical subjects covered by former us classification4%
G02BOptical elements, systems or apparatus3%
PatentTitleYear
11,043,343Assembly and method for damping contact bounce in high-voltage circuit breakers202110,991,527Contact piece for a high-voltage circuit breaker and method for producing same202110,685,798Interrupter unit for a circuit breaker202010,199,189Switchgear arrangement20199,748,059'Switching device arrangement'20179,741,514'Switching arrangement'20179,666,392'Electric switching device'20179,484,161'Electrical switching device'20169,460,873'Switching method and switching device'20169,396,891'Switchgear arrangement'20169,251,981'Arrangement comprising a circuit breaker unit'20169,135,586'System for dynamic parallel looping of repetitive tasks during execution of process-flows in process runtime'20159,076,611'Circuit breaker unit'20158,975,551'Arc chamber for a circuit breaker and circuit breaker having an arc chamber'20158,633,413'Switchgear assembly with a contact gap'20148,598,483'High-voltage power switch having a contact gap equipped with switching gas deflection elements'20138,178,966'Integrated coolant circuit arrangement, operating method and production method'20128,124,521'Electrical through contact'20128,048,479'Method for placing material onto a target board by means of a transfer board'20117,872,349'Integrated coolant circuit arrangement, operating method and production method'20117,679,021'Switching device'20107,470,546'Method and arrangement for taking up a first medium, which is present in a first phase, into a capillary device'20087,410,794'Device based on partially oxidized porous silicon and method for its production'2008D0567623'Tool handle'20087,214,582'Semiconductor substrate and semiconductor circuit formed therein and fabrication methods'20077,163,660'Arrangement for taking up liquid analytes'20076,887,437'Reactor configuration and method for producing it'20056,863,769'Configuration and method for making contact with the back surface of a semiconductor substrate'20056,746,880'Method for making electrical contact with a rear side of a semiconductor substrate during its processing'20046,744,000'High-voltage circuit breaker having an insulating nozzle'20046,693,024'Semiconductor component with a semiconductor body having a multiplicity of pores and method for fabricating'20046,646,850'High-voltage power breaker having an outlet flow channel'20036,614,575'Optical structure and method for producing the same'20036,558,770'Perforated work piece, and method for producing it'20036,548,846'Storage capacitor for a DRAM'20036,477,226'X-ray analysis device with X-ray optical semi-conductor construction element'20026,468,348'Method of producing an open form'20026,441,424'Integrated circuit configuration having at least one capacitor and method for producing the same'20026,365,863'High voltage circuit-breaker with a counter-contact which can be actuated'20026,324,259'Scattered-ray grid, particularly for a medical X-ray device, and a method of determining the position of the absorption elements of a scattered-ray grid'20016,271,494'High voltage circuit breaker with two arcing contacts which can be actuated in an opposite direction'20016,215,140'Electrically programmable non-volatile memory cell configuration'20016,207,917'Compressed gas power switch'20016,204,119'Manufacturing method for a capacitor in an integrated memory circuit'20016,194,765'Integrated electrical circuit having at least one memory cell and method for fabricating it'20016,177,643'High-voltage circuit-breaker having an axially displaceable field electrode'20016,165,835'Method for producing a silicon capacitor'20006,140,177'Process of forming a semiconductor capacitor including forming a hemispherical grain statistical mask with silicon and germanium'20006,133,126'Method for fabricating a dopant region'20006,127,220'Manufacturing method for a capacitor in an integrated storage circuit'20006,117,790'Method for fabricating a capacitor for a semiconductor memory configuration'20006,047,044'Stray radiation grid'20006,040,970'Interrupter unit of a high-voltage power circuit breaker'20006,040,995'Method of operating a storage cell arrangement'20006,033,534'Method for producing an Al-containing layer with a planar surface on a substrate having hole structures with a high aspect ratio in the surface'20006,022,786'Method for manufacturing a capacitor for a semiconductor arrangement'20005,987,208'Optical structure and method for its production'19995,943,571'Method for manufacturing fine structures'19995,759,903'Circuit structure having at least one capacitor and a method for the manufacture thereof'19985,739,495'Puffer-type circuit breaker and nozzle emitting gas with coaxial abutting plastic tube'19985,717,183'High-voltage power switch with a cooling device for cooling the quenching gas'19985,685,969'Sensor arrangement'19975,589,673'Electric high-tension circuit breaker'19965,563,389'High-voltage power switch'19965,534,673'Electric high-voltage circuit breaker'19965,500,385'Method for manufacturing a silicon capacitor by thinning'19965,494,832'Method for manufacturing a solar cell from a substrate wafer'19965,480,197'Toggle catch for intake air filters of internal-combustion engines, compressors and other machines which take in air'19965,403,752'Method for manufacturing a pyrodetector apparatus'19955,365,405'Multi-chip module'19945,360,759'Method for manufacturing a component with porous silicon'19945,306,647'Method for manufacturing a solar cell from a substrate wafer'19945,262,021'Method of manufacturing a perforated workpiece'19935,209,833'Method and apparatus for large-area electrical contacting of a semiconductor crystal body with the assistance of electrolytes'19935,206,523'Microporous crystalline silicon of increased band-gap for semiconductor applications'19935,130,643'Method for determining the recombination rate of minority carriers at boundary surfaces between semiconductors and other substances'19925,128,514'Black radiator for use as an emitter in calibratable gas sensors'19925,024,723'Method of producing a thin silicon on insulator layer by wafer bonding and chemical thinning'19915,010,294'Method for topically-resolved determination of the diffusion length of minority charge carriers in a semiconductor crystal body with the assistance of an electrolytic cell'19914,962,879'Method for bubble-free bonding of silicon wafers'19904,881,292'Housing attachment assembly with a plastic attachment tab and a clip'19894,874,484'Etching method for generating apertured openings or trenches in layers or substrates composed of n-doped silicon'19894,841,239'Method and measuring instrument for identifying the diffusion length of the minority charge carriers for non-destructive detection of flaws and impurities in semiconductor crystal bodies'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2021Patents assigned to SIEMENS AG (57)· patent assignee history
1989–2012Based in Munich, DE· patent location history
1996Based in Berlin, DE· patent location history
1998–2021Based in Treuenbrietzen, DE· patent location history
2002–2012Patents assigned to INFINEON TECHNOLOGIES AG (15)· patent assignee history
2002–2004Based in Mnchen, DE· patent location history
2005–2012Based in München, DE· patent location history
2012–2016Patents assigned to LEHMANN VOLKER (8)· patent assignee history
2013–2014Patents assigned to DIENEMANN HOLD (2)· patent assignee history
2014–2016Patents assigned to CERNAT RADU-MARIAN (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 57 | 1989–2021 |
| INFINEON TECHNOLOGIES AG | 15 | 2002–2012 |
| LEHMANN VOLKERself | 8 | 2012–2016 |
| CERNAT RADU-MARIAN | 3 | 2014–2016 |
| DIENEMANN HOLD | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Munich, DE | 36 | 1989–2012 |
| Treuenbrietzen, DE | 24 | 1998–2021 |
| Mnchen, DE | 8 | 2002–2004 |
| München, DE | 5 | 2005–2012 |
| Berlin, DE | 3 | 1996 |