Inventor

TOD HEILES

Inventor
US

Overview

7→
Patents
2022–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 7 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics28%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering28%
B22FWorking metallic powder12%
G06TImage data processing or generation, in general12%
G05BControl or regulating systems in general8%
G06FElectric digital data processing4%
G06NComputing arrangements based on specific computational models4%
Y02PClimate change mitigation technologies in the production or processing of goods4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (7)· patent assignee history
2022–2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO72022–2024
Locations
LocationPatentsSpan
US72022–2024