Inventor
Brandon Rubenstein
Inventor
Loveland, CO, US
Overview
Patents· 52 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits21%
G06FElectric digital data processing17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H01RElectrically-conductive connections6%
Y10TTechnical subjects covered by former us classification5%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
F04DNon-positive-displacement pumps3%
PatentTitleYear
11,033,019Photographic camouflaged scent-free game calls and method of manufacturing same202110,921,300Internal server air quality station202110,667,435Accelerated rack acclimator202010,519,960Fan failure detection and reporting201910,126,804Balancing input phases across server rack power supplies20189,886,068'Cable management techniques for computing systems'20189,606,586'Heat transfer device'20179,603,282'Datacenter and cooling control fault-tolerance using compute resources'20179,588,558'On-chip integrated processing and power generation'20179,541,299'Setting-independent climate regulator control'20179,351,430'Renewable energy based datacenter cooling'20169,345,166'Rackless computing equipment construction'20169,060,436'Land grid array socket assembly'20159,055,698'Fluid flow control for computing device'20159,019,704'Heat storage by phase-change material'20158,982,552'System for providing physically separated compute and I/O resources in the datacenter to enable space and power savings'20158,934,235'Heat transfer device with phase change material'20158,768,532'Indirect thermal fan control'20148,599,557'Printed circuit board cooling assembly'20138,542,488'Cooling apparatus for an IC'20138,020,608'Heat sink fin with stator blade'20117,926,552'Jacket for heat dispersion device'20117,619,899'Securable electronic module'20097,567,438'Heat sink with precompressed bias member'20097,544,072'Retractable protection apparatus for electronic device pins'20097,516,917'Management device for excess cabling'20097,480,143'Variable-gap thermal-interface device'20097,420,816'Apparatus and method for installing an electrical support structure'20087,408,788'Device and method for circuit board insertion and removal'20087,385,824'Processor module with rigidly coupled processor and voltage-regulator heat sinks'20087,374,441'Zero insertion force connector assembly for circuit boards/cards'20087,344,384'Bolster plate assembly for processor module assembly'20087,270,572'Component connector'20077,233,497'Surface mount heat sink'20077,197,806'Fastener for variable mounting'20077,037,134'Interconnect system having housing assembly with pin receptor'20067,021,895'Fan module with integrated diffuser'20066,985,359'Variable-wedge thermal-interface device'20066,967,843'System and method for dissipating heat from an electronic board'20056,948,235'Shroud installation apparatus and method of installation'20056,807,057'Apparatus and method for cooling an electronic device'20046,802,680'Torque limiting fastener'20046,798,663'Heat sink hold-down with fan-module attach location'20046,702,237'Apparatus and method for anchoring a cable'20046,685,489'Circuit board leverage mechanism'20046,662,411'Mushroom head clip fastener'20036,627,811'Cable protective shield assembly'20036,616,252'Permanently attached rackmount handles and spacing brackets'20036,583,357'Cable retention system'20036,556,449'Backplane assembly with ejection mechanism'20036,465,750'Cover for nonfunctional buttons'20026,456,501'Quick release mechanism for sliding rail'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2015Based in Loveland, CO, US· patent location history
2003–2015Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (36)· patent assignee history
2008Based in Fort Collins, CO, US· patent location history
2013–2015Patents assigned to RUBENSTEIN BRANDON (6)· patent assignee history
2014–2017Patents assigned to MICROSOFT CORP (7)· patent assignee history
2014–2017Patents assigned to RUBENSTEIN BRANDON A (3)· patent assignee history
2014–2019Based in Lynnwood, WA, US· patent location history
2016–2021Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (11)· patent assignee history
2020–2021Based in Issaquah, WA, US· patent location history
2021Based in Detroit Lakes, MN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 36 | 2003–2015 |
| MICROSOFT TECHNOLOGY LICENSING LLC | 11 | 2016–2021 |
| MICROSOFT CORP | 7 | 2014–2017 |
| RUBENSTEIN BRANDONself | 6 | 2013–2015 |
| RUBENSTEIN BRANDON Aself | 3 | 2014–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Loveland, CO, US | 36 | 2002–2015 |
| Lynnwood, Washington, US | 11 | 2014–2019 |
| Issaquah, Washington, US | 2 | 2020–2021 |
| Fort Collins, CO, US | 2 | 2008 |
| Detroit Lakes, Minnesota, US | 1 | 2021 |