Inventor

DAIKI ISHIZUKA

Inventor
JP

Overview

3→
Patents
2021–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Bprimary
B23BTurning33%
B23KSoldering or unsoldering17%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling17%
C23CCoating metallic material17%
Y10TTechnical subjects covered by former us classification17%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to ENSHU SEISAKU KK (3)· patent assignee history
2021–2024Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ENSHU SEISAKU KK32021–2024
Locations
LocationPatentsSpan
JP32021–2024