Inventor

Sen-Hou Ko

Inventor

Cupertino, CA, US

Overview

1998–2017

Patent span

Performing operations

Primary field (CPC B)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing42%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%

B08BCleaning in general6%

H01LSemiconductor devices3%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%

A46BBrushes2%

B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool2%

B24DTools for grinding, buffing or sharpening2%

B82YSpecific uses or applications of nanostructures2%

H10DInorganic electric semiconductor devices2%

PatentTitleYear

9,711,381'Methods and apparatus for post-chemical mechanical planarization substrate cleaning'2017 9,646,859'Disk-brush cleaner module with fluid jet'2017 9,508,575'Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing'2016 8,813,293'Apparatus and methods for brush and pad conditioning'2014 8,550,879'Polishing pad conditioner'2013 8,458,843'Apparatus and methods for brush and pad conditioning'2013 8,142,260'Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads'2012 8,125,654'Methods and apparatus for measuring substrate edge thickness during polishing'2012 7,993,485'Methods and apparatus for processing a substrate'2011 7,828,626'Apparatus for conditioning processing pads'2010 7,749,048'Polishing pad conditioning process'2010 7,666,061'Method for conditioning processing pads'2010 7,207,878'Conductive polishing article for electrochemical mechanical polishing'2007 7,199,056'Low cost and low dishing slurry for polysilicon CMP'2007 7,182,680'Apparatus for conditioning processing pads'2007 7,175,505'Method for adjusting substrate processing times in a substrate polishing system'2007 7,115,024'Profile control platen'2006 7,104,267'Planarized copper cleaning for reduced defects'2006 7,040,971'Carrier head with a flexible membrane'2006 6,991,528'Conductive polishing article for electrochemical mechanical polishing'2006 6,913,518'Profile control platen'2005 6,896,584'Method of controlling carrier head with multiple chambers'2005 6,857,946'Carrier head with a flexure'2005 6,824,455'Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus'2004 6,699,115'Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus'2004 6,669,538'Pad cleaning for a CMP system'2003 6,656,842'Barrier layer buffing after Cu CMP'2003 6,648,740'Carrier head with a flexible membrane to form multiple chambers'2003 6,540,594'Carrier head with a flexible membrane for a chemical mechanical polishing system'2003 6,520,847'Polishing pad having a grooved pattern for use in chemical mechanical polishing'2003 6,511,367'Carrier head with local pressure control for a chemical mechanical polishing apparatus'2003 6,506,104'Carrier head with a flexible membrane'2003 6,432,826'Planarized Cu cleaning for reduced defects'2002 6,386,955'Carrier head with a flexible membrane for a chemical mechanical polishing system'2002 6,368,191'Carrier head with local pressure control for a chemical mechanical polishing apparatus'2002 6,277,010'Carrier head with a flexible membrane for a chemical mechanical polishing system'2001 6,183,354'Carrier head with a flexible membrane for a chemical mechanical polishing system'2001 6,146,259'Carrier head with local pressure control for a chemical mechanical polishing apparatus'2000 6,106,378'Carrier head with a flexible membrane for a chemical mechanical polishing system'2000 5,964,653'Carrier head with a flexible membrane for a chemical mechanical polishing system'1999 5,938,507'Linear conditioner apparatus for a chemical mechanical polishing system'1999 5,921,855'Polishing pad having a grooved pattern for use in a chemical mechanical polishing system'1999 5,795,215'Method and apparatus for using a retaining ring to control the edge effect'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2017Patents assigned to APPLIED MATERIALS INC (43)· patent assignee history

1998–2010Based in Cupertino, CA, US· patent location history

2003–2017Based in Sunnyvale, CA, US· patent location history

2012–2017Patents assigned to KO SEN-HOU (6)· patent assignee history

2012–2013Patents assigned to CHANG SHOU-SUNG (2)· patent assignee history

2013–2017Patents assigned to KARUPPIAH LAKSHMANAN (3)· patent assignee history

2017Patents assigned to ALONZO GERALD J (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
APPLIED MATERIALS INC	43	1998–2017
KO SEN-HOUself	6	2012–2017
KARUPPIAH LAKSHMANAN	3	2013–2017
CHANG SHOU-SUNG	2	2012–2013
ALONZO GERALD J	1	2017

Locations

Location	Patents	Span
Cupertino, California, US	24	1998–2010
Sunnyvale, California, US	19	2003–2017