Inventor
Michael Grillberger
Inventor
Radebeul, DE
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
10,014,279Methods of forming 3-D integrated semiconductor devices having intermediate heat spreading capabilities20189,318,468'3-D integrated semiconductor device comprising intermediate heat spreading capabilities'20168,920,027'Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems'20148,598,714'Semiconductor device comprising through hole vias having a stress relaxation mechanism'20138,501,545'Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime'20138,497,583'Stress reduction in chip packaging by a stress compensation region formed around the chip'20138,479,578'Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts'20138,482,123'Stress reduction in chip packaging by using a low-temperature chip-package connection regime'20138,399,335'Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features'20138,357,610'Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics'20138,080,866'3-D integrated semiconductor device comprising intermediate heat spreading capabilities'20117,982,313'Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability'20117,829,357'Method and test structure for monitoring CMP processes in metallization layers of semiconductor devices'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2018Patents assigned to GLOBALFOUNDRIES INC (12)· patent assignee history
2010–2018Based in Radebeul, DE· patent location history
2011–2016Patents assigned to GRILLBERGER MICHAEL (10)· patent assignee history
2011–2016Patents assigned to FEUSTEL FRANK (4)· patent assignee history
2011–2016Patents assigned to WERNER THOMAS (4)· patent assignee history
2013–2014Patents assigned to LEHR MATTHIAS (4)· patent assignee history
2013Based in Mü{umlaut over ( )}nchen, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES INC | 12 | 2010–2018 |
| GRILLBERGER MICHAELself | 10 | 2011–2016 |
| FEUSTEL FRANK | 4 | 2011–2016 |
| LEHR MATTHIAS | 4 | 2013–2014 |
| WERNER THOMAS | 4 | 2011–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Radebeul, DE | 12 | 2010–2018 |
| Mü{umlaut over ( )}nchen, DE | 1 | 2013 |