Inventor
Yoshikuni Migiyama
Inventor
JP
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
B28DWorking stone or stone-like materials4%
B05CApparatus for applying fluent materials to surfaces, in general2%
B23KSoldering or unsoldering2%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
B24BMachines, devices, or processes for grinding or polishing2%
B25JManipulators2%
PatentTitleYear
12,463,028Method of processing wafer202512,421,362Resin sheet, manufacturing method of resin sheet, and resin covering method202512,230,520Protective component forming apparatus202511,942,346Resin applying machine202411,935,778Holding mechanism including Bernoulli pad202411,915,963Protective member forming apparatus202411,764,085Processing apparatus202311,554,455Processing apparatus202311,551,947Resin coating applying apparatus and method of applying resin coating202311,342,208Processing method and resin applying machine202211,298,928Protective sheet disposing method202211,135,828Protective member forming apparatus2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to DISCO CORP (12)· patent assignee history
2021–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 12 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 12 | 2021–2025 |