Inventor
TING-JUNG CHEN
Inventor
TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices23%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems21%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers10%
H10NElectric solid-state devices not otherwise provided for10%
H01LSemiconductor devices8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G02BOptical elements, systems or apparatus5%
H04NPictorial communication, e.g. television5%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
12,552,664Self-aligned acoustic hole formation in piezoelectrical MEMS microphone202612,358,785Comb electrode release process for MEMS structure202512,272,585Wafer chuck structure with holes in upper surface to improve temperature uniformity202512,238,478Top notch slit profile for MEMS device202512,213,383Fully-wet via patterning method in piezoelectric sensor202512,180,064Curved cantilever design to reduce stress in MEMS actuator202412,133,467Microelectromechanical system with piezoelectric film and manufacturing method thereof202412,043,537Method of manufacturing a microelectromechanical systems (MEMS) device202412,006,208Micro-electromechanical system device including a precision proof mass element and methods for forming the same202411,932,531Curved cantilever design to reduce stress in MEMS actuator202411,693,295Auto-focusing device and method of fabricating the same202311,661,337Comb electrode release process for MEMS structure202311,634,320Micro-electromechanical system device including a precision proof mass element and methods for forming the same202311,557,710Fully-wet via patterning method in piezoelectric sensor202311,482,663Microelectromechanical system with piezoelectric film and manufacturing method thereof202211,312,615Method to form a rough crystalline surface202211,203,522Sidewall stopper for MEMS device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 17 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 17 | 2021–2026 |