Inventor
Kazuo Teshirogi
Inventor
Kawasaki, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
Y10TTechnical subjects covered by former us classification13%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
B24BMachines, devices, or processes for grinding or polishing9%
B29CShaping or joining of plastics3%
H01LSemiconductor devices3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
B23KSoldering or unsoldering1%
PatentTitleYear
9,010,615'Bonding apparatus and bonding method'20158,962,470'Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus'20158,444,799'Method for manufacturing semiconductor device and surface protective tape'20138,440,545'Method of manufacturing semiconductor device with spraying fluid'20138,016,973'Film bonding method, film bonding apparatus, and semiconductor device manufacturing method'20117,857,140'Semiconductor wafer storage case and semiconductor wafer storing method'20107,820,487'Manufacturing method of semiconductor device'20107,704,856'Semiconductor device, wiring substrate forming method, and substrate processing apparatus'20107,655,505'Manufacturing method of semiconductor device'20107,648,907'Semiconductor device, wiring substrate forming method, and substrate processing apparatus'20107,571,538'Vacuum fixing jig for semiconductor device'20097,563,343'Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus'20097,485,962'Semiconductor device, wiring substrate forming method, and substrate processing apparatus'20097,479,627'Semiconductor device having transparent member and manufacturing method of the same'20097,432,114'Semiconductor device manufacturing method'20087,395,847'Jig for a semiconductor substrate'20087,109,561'Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig'20066,951,800'Method of making semiconductor device that has improved structural strength'20056,902,944'Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig'20056,824,643'Method and device of peeling semiconductor device using annular contact members'20046,750,074'Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig'20046,528,348'Semiconductor device having protruding electrodes higher than a sealed portion'20036,461,942'Semiconductor chip removing and conveying method and device'20026,388,333'Semiconductor device having protruding electrodes higher than a sealed portion'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2015Patents assigned to FUJITSU LTD (14)· patent assignee history
2002–2015Based in Kawasaki, JP· patent location history
2009–2010Patents assigned to FUJITSU MICROELECTRONICS LTD (4)· patent assignee history
2010–2015Patents assigned to FUJITSU SEMICONDUCTOR LTD (6)· patent assignee history
2013–2015Patents assigned to TESHIROGI KAZUO (3)· patent assignee history
2013Patents assigned to FUKAYA HIRONORI (2)· patent assignee history
2013Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 14 | 2002–2015 |
| FUJITSU SEMICONDUCTOR LTD | 6 | 2010–2015 |
| FUJITSU MICROELECTRONICS LTD | 4 | 2009–2010 |
| TESHIROGI KAZUOself | 3 | 2013–2015 |
| FUKAYA HIRONORI | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 23 | 2002–2015 |
| Yokohama, JP | 1 | 2013 |