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Inventor

Yin Wei LIM

Inventor
SG

Overview

3→
Patents
2025–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
G06NComputing arrangements based on specific computational models11%
G06TImage data processing or generation, in general11%
G06VImage or video recognition or understanding11%
H01JElectric discharge tubes or discharge lamps11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,588,533Grain structure engineering for metal gapfill materials202612,518,367Defect classification of processed wafers202612,469,683Water vapor plasma to enhance surface hydrophilicity2025

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2025–2026Patents assigned to APPLIED MATERIALS INC (3)· patent assignee history
2025–2026Based in SG· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC32025–2026
Locations
LocationPatentsSpan
SG32025–2026