Inventor
Hiroki Nezu
Inventor
Hamura, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
B24BMachines, devices, or processes for grinding or polishing23%
C23CCoating metallic material15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests15%
PatentTitleYear
6,899,603'Polishing apparatus'20056,719,618'Polishing apparatus'20046,565,422'Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus'20035,670,421'Process for forming multilayer wiring'19975,498,768'Process for forming multilayer wiring'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2003Patents assigned to HITACHI LTD (3)· patent assignee history
1996–1997Based in Tokyo, JP· patent location history
2003–2005Based in Hamura, JP· patent location history
2004–2005Patents assigned to RENESAS TECH CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 3 | 1996–2003 |
| RENESAS TECH CORP | 2 | 2004–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hamura, JP | 3 | 2003–2005 |
| Tokyo, JP | 2 | 1996–1997 |