Inventor
KENGO AOYA
Inventor
JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H10DInorganic electric semiconductor devices6%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications3%
PatentTitleYear
12,272,626Conductive members atop semiconductor packages202512,154,861Frame design in embedded die package202412,125,799Embedded die packaging with integrated ceramic substrate202412,046,542Heat-dissipating wirebonded members on package surfaces202412,040,260Electronic package with surface contact wire extensions202411,942,384Semiconductor package having an interdigitated mold arrangement202411,923,320Semiconductor device having tapered metal coated sidewalls202411,848,244Leaded wafer chip scale packages202311,601,065Power converter module202311,410,875Fan-out electronic device202211,387,179IC package with half-bridge power module202211,183,460Embedded die packaging with integrated ceramic substrate202111,183,441Stress buffer layer in embedded package202111,158,595Embedded die package multichip module2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TEXAS INSTRUMENTS INC (14)· patent assignee history
2021–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 14 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 14 | 2021–2025 |