Inventor
Nazmul Habib
Inventor
South Burlington, VT, US
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables31%
G06FElectric digital data processing22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H01LSemiconductor devices7%
G05BControl or regulating systems in general5%
G01KMeasuring temperature4%
H10DInorganic electric semiconductor devices3%
G11CStatic stores2%
H10BElectronic memory devices2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
11,054,459Optimization of integrated circuit reliability202110,996,259Optimization of integrated circuit reliability202110,989,754Optimization of integrated circuit reliability202110,794,952Product performance test binning202010,700,013IC wafer for identification of circuit dies after dicing202010,564,214Optimization of integrated circuit reliability202010,539,611Integrated circuit chip reliability qualification using a sample-specific expected fail rate202010,216,870Methodology to prevent metal lines from current pulse damage201910,168,685Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies201910,162,325Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies201810,089,161System and method for managing semiconductor manufacturing defects201810,067,184Product performance test binning20189,940,430Burn-in power performance optimization20189,891,275'Integrated circuit chip reliability qualification using a sample-specific expected fail rate'20189,880,892'System and method for managing semiconductor manufacturing defects'20189,791,502'On-chip usable life depletion meter and associated method'20179,739,824'Optimization of integrated circuit reliability'20179,639,645'Integrated circuit chip reliability using reliability-optimized failure mechanism targeting'20179,625,325'System and method for identifying operating temperatures and modifying of integrated circuits'20179,618,566'Systems and methods to prevent incorporation of a used integrated circuit chip into a product'20179,594,868'Scaling voltages in relation to die location'20179,506,977'Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies'20169,489,482'Reliability-optimized selective voltage binning'20169,430,603'Scaling voltages in relation to die location'20169,395,403'Optimization of integrated circuit reliability'20169,354,953'System integrator and system integration method with reliability optimized integrated circuit chip selection'20169,202,554'Methods and circuits for generating physically unclonable function'20159,117,045'System and method to predict chip IDDQ and control leakage components'20159,082,875'Methods for normalizing strain in semicondcutor devices and strain normalized semiconductor devices'20159,064,087'Semiconductor device reliability model and methodologies for use thereof'20159,058,250'In-situ computing system failure avoidance'20158,949,767'Reliability evaluation and system fail warning methods using on chip parametric monitors'20158,943,444'Semiconductor device reliability model and methodologies for use thereof'20158,521,500'Method and device for measuring integrated circuit power supply noise and calibration of power supply noise analysis models'20138,504,975'Reliability evaluation and system fail warning methods using on chip parametric monitors'20138,421,495'Speed binning for dynamic and adaptive power control'20138,298,876'Methods for normalizing strain in semiconductor devices and strain normalized semiconductor devices'20128,120,356'Measurement methodology and array structure for statistical stress and test of reliabilty structures'20128,114,686'Phase change material based temperature sensor'20128,095,907'Reliability evaluation and system fail warning methods using on chip parametric monitors'20128,055,822'Multicore processor having storage for core-specific operational data'20118,020,138'Voltage island performance/leakage screen monitor for IP characterization'20117,917,451'Methods, apparatus, and program products to optimize semiconductor product yield prediction for performance and leakage screens'20117,884,599'HDL design structure for integrating test structures into an integrated circuit design'20117,882,455'Circuit and method using distributed phase change elements for across-chip temperature profiling'20117,868,640'Array-based early threshold voltage recovery characterization measurement'20117,803,644'Across reticle variation modeling and related reticle'20107,795,605'Phase change material based temperature sensor'20107,656,182'Testing method using a scalable parametric measurement macro'20107,653,888'System for and method of integrating test structures into an integrated circuit'20107,560,946'Method of acceptance for semiconductor devices'20097,512,915'Embedded test circuit for testing integrated circuits at the die level'20097,487,477'Parametric-based semiconductor design'20097,382,149'System for acquiring device parameters'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2021Patents assigned to IBM (48)· patent assignee history
2008–2021Based in South Burlington, VT, US· patent location history
2012–2018Patents assigned to HABIB NAZMUL (9)· patent assignee history
2012–2015Patents assigned to MCMAHON ROBERT (4)· patent assignee history
2012–2013Patents assigned to BICKFORD JEANNE P (3)· patent assignee history
2012–2019Based in Essex Junction, VT, US· patent location history
2015–2020Based in Colchester, VT, US· patent location history
2017–2020Patents assigned to GLOBALFOUNDRIES INC (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 48 | 2008–2021 |
| HABIB NAZMULself | 9 | 2012–2018 |
| GLOBALFOUNDRIES INC | 5 | 2017–2020 |
| MCMAHON ROBERT | 4 | 2012–2015 |
| BICKFORD JEANNE P | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| South Burlington, VT, US | 43 | 2008–2021 |
| Colchester, VT, US | 8 | 2015–2020 |
| Essex Junction, VT, US | 3 | 2012–2019 |