LexDanaLexDanabeta
Inventor

Larry Flannery

Inventor
Warrenton, MO, US

Overview

3→
Patents
2010–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
H01LSemiconductor devices17%
H10DInorganic electric semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
8,796,116'Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods'20147,846,006'Dressing a wafer polishing pad'20107,846,007'System and method for dressing a wafer polishing pad'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010Patents assigned to MEMC ELECTRONIC MATERIALS (2)· patent assignee history
2010–2014Based in Warrenton, MO, US· patent location history
2014Patents assigned to FLANNERY LARRY (1)· patent assignee history
2014Patents assigned to GRABBE ALEXIS (1)· patent assignee history
2014Patents assigned to SUNEDISON SEMICONDUCTOR LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEMC ELECTRONIC MATERIALS22010
FLANNERY LARRYself12014
GRABBE ALEXIS12014
SUNEDISON SEMICONDUCTOR LTD12014
Locations
LocationPatentsSpan
Warrenton, MO, US32010–2014