Inventor
Tan Kim Hwee
Inventor
Singapore, SG
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
B23KSoldering or unsoldering8%
H01FMagnets8%
H05KPrinted circuits8%
H10DInorganic electric semiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y02PClimate change mitigation technologies in the production or processing of goods8%
PatentTitleYear
7,781,870'Wire bond and redistribution layer process'20107,456,496'Package design and method of manufacture for chip grid array'20086,929,981'Package design and method of manufacture for chip grid array'20056,750,082'Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip'20046,734,039'Semiconductor chip grid array package design and method of manufacture'20046,510,976'Method for forming a flip chip semiconductor package'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2008Patents assigned to ADVANPACK SOLUTIONS PTE LTD (5)· patent assignee history
2003–2008Based in Singapore, SG· patent location history
2010Patents assigned to MICRO DEVICES CORP CALIFORNIA (1)· patent assignee history
2010Based in Jiangyin, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANPACK SOLUTIONS PTE LTD | 5 | 2003–2008 |
| MICRO DEVICES CORP CALIFORNIA | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 5 | 2003–2008 |
| Jiangyin, CN | 1 | 2010 |