Inventor
BILAL KHALAF
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits8%
G01RMeasuring electric variables4%
H01RElectrically-conductive connections4%
PatentTitleYear
11,894,334Dual head capillary design for vertical wire bond202411,848,311Microelectronic packages having a die stack and a device within the footprint of the die stack202311,817,438System in package with interconnected modules202311,811,182Solderless BGA interconnect202311,710,674Embedded component and methods of making the same202311,700,696Buried electrical debug access port202311,373,974Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size202211,329,027Microelectronic packages having a die stack and a device within the footprint of the die stack202211,315,843Embedded component and methods of making the same202211,145,632High density die package configuration on system boards2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to INTEL CORP (10)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 10 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2021–2024 |