Inventor
BRIGHAM NAVAJA
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H05KPrinted circuits7%
H10DInorganic electric semiconductor devices7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
12,543,599Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrate202611,948,877Hybrid package apparatus and method of fabricating202411,581,262Package comprising a die and die side redistribution layers (RDL)202311,552,023Passive component embedded in an embedded trace substrate (ETS)202311,177,223Electromagnetic interference shielding for packages and modules2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to QUALCOMM INC (5)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 5 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2021–2026 |