Inventor
JUN QIAN
Inventor
US
Overview
Patents· 56 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
G06NComputing arrangements based on specific computational models12%
B24BMachines, devices, or processes for grinding or polishing12%
H01LSemiconductor devices12%
G06FElectric digital data processing7%
C23CCoating metallic material5%
G01BMeasuring length, thickness or similar linear dimensions5%
G05BControl or regulating systems in general5%
G06VImage or video recognition or understanding4%
G06TImage data processing or generation, in general3%
PatentTitleYear
12,561,998Synthetic data fine-tuned optical character recognition engine for extensible markup language document reconstruction202612,522,793Accurate positioning mechanism of high-speed biological shaking table202612,524,675Semiconductor fabrication using machine learning approach to generating process control parameters202612,525,460Method of manufacturing semiconductor structure including removing hard mask layer and dielectric material layer exposed by patterned photoresist layer202612,494,002Synthetic table generation pipeline for training deep table extraction models202512,479,062Determining substrate orientation with acoustic signals202512,451,380Semiconductor fabrication using process control parameter matrix202512,449,327Method and apparatus for lamp housing crack detection202512,448,687Dynamic precursor dosing for atomic layer deposition202512,403,561Eddy current monitoring to detect vibration in polishing202512,403,560Determining substrate precession with acoustic signals202512,370,646Polishing apparatus using machine learning and compensation for pad thickness202512,374,139Generating synthetic training data including document images with key-value pairs202512,371,025Autonomous lane change method and apparatus, and storage medium202512,361,736Multi-stage machine learning model training for key-value extraction202512,354,871Ultrathin atomic layer deposition film accuracy thickness control202512,272,047Residue measurement from machine learning based processing of substrate images202512,261,038Gapfill of variable aspect ratio features with a composite PEALD and PECVD method202512,257,665Machine vision as input to a CMP process control algorithm2025D1067472LED light bulb202512,249,170Vision-based document language identification by joint supervision202512,230,020Techniques for dynamic time-based custom model generation202512,169,925System using film thickness estimation from machine learning based processing of substrate images202412,136,574Technique for training neural network for use in in-situ monitoring during polishing and polishing system202412,099,436Application performance monitoring for monolithic applications and distributed systems202412,090,599Determination of substrate layer thickness with polishing pad wear compensation202412,077,859Variable cycle and time RF activation method for film thickness matching in a multi-station deposition system202412,057,354Trained neural network in in-situ monitoring during polishing and polishing system202412,020,159Training spectrum generation for machine learning system for spectrographic monitoring202411,989,492Preston matrix generator202411,989,964Techniques for graph data structure augmentation202411,970,772Dynamic precursor dosing for atomic layer deposition202411,919,748Hoist for transferred materials in underground auxiliary transportation system and method thereof202411,847,776System using film thickness estimation from machine learning based processing of substrate images202311,836,913Film thickness estimation from machine learning based processing of substrate images202311,838,092Wireless communication apparatus and method202311,824,858Selective and granular multi-customer support access202311,791,224Technique for training neural network for use in in-situ monitoring during polishing and polishing system202311,780,047Determination of substrate layer thickness with polishing pad wear compensation2023D0994992Pet playpen2023D0994230Pet playpen202311,699,595Imaging for monitoring thickness in a substrate cleaning system202311,670,503Method of atomic layer deposition202311,663,914Geohash-based traffic management202311,658,078Using a trained neural network for use in in-situ monitoring during polishing and polishing system202311,651,207Training spectrum generation for machine learning system for spectrographic monitoring202311,646,198Ultrathin atomic layer deposition film accuracy thickness control202311,577,356Machine vision as input to a CMP process control algorithm202311,524,382Polishing apparatus using machine learning and compensation for pad thickness202211,507,824Training spectrum generation for machine learning system for spectrographic monitoring202211,508,859Method for forming doped epitaxial layer of contact image sensor202211,504,821Predictive filter for polishing pad wear rate monitoring202211,479,856Multi-cycle ALD process for film uniformity and thickness profile modulation202211,449,016Action control method and apparatus202211,255,017Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system202211,180,850Dynamic precursor dosing for atomic layer deposition2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to LAM RES CORP (10)· patent assignee history
2021–2026Based in US· patent location history
2022–2026Patents assigned to APPLIED MATERIALS INC (26)· patent assignee history
2022–2025Patents assigned to HUAWEI TECH CO LTD (2)· patent assignee history
2022–2026Based in CN· patent location history
2023Patents assigned to CHEN LIUZHU (2)· patent assignee history
2023Based in GB· patent location history
2024–2026Patents assigned to ORACLE INT CORP (8)· patent assignee history
2026Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 26 | 2022–2026 |
| LAM RES CORP | 10 | 2021–2025 |
| ORACLE INT CORP | 8 | 2024–2026 |
| CHEN LIUZHU | 2 | 2023 |
| HUAWEI TECH CO LTD | 2 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 44 | 2021–2026 |
| CN | 9 | 2022–2026 |
| GB | 2 | 2023 |
| SG | 1 | 2026 |