Inventor
Fen F. Jamin
Inventor
Wappingers Falls, NY, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
B24BMachines, devices, or processes for grinding or polishing19%
C09GPolishing compositions8%
H10DInorganic electric semiconductor devices8%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
H10BElectronic memory devices4%
PatentTitleYear
7,214,623'Planarization system and method using a carbonate containing fluid'20077,064,064'Copper recess process with application to selective capping and electroless plating'20067,040,966'Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers'20067,041,600'Methods of planarization'20066,975,032'Copper recess process with application to selective capping and electroless plating'20056,780,695'BiCMOS integration scheme with raised extrinsic base'20046,764,922'Method of formation of an oxynitride shallow trench isolation'20046,709,951'Oxynitride shallow trench isolation and method of formation'20046,498,383'Oxynitride shallow trench isolation and method of formation'20026,368,969'Chemical-mechanical polishing methods'20026,365,328'Semiconductor structure and manufacturing method'20026,344,414'Chemical-mechanical polishing system having a bi-material wafer backing film assembly'20026,264,789'System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer'20016,225,224'System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer'20016,171,513'Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier'20016,149,830'Composition and method for reducing dishing in patterned metal during CMP process'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2007Patents assigned to IBM (16)· patent assignee history
2000Patents assigned to SIEMENS AG (1)· patent assignee history
2000–2007Based in Wappingers Falls, NY, US· patent location history
2001–2002Patents assigned to INFINEON TECHNOLOGIES CORP (2)· patent assignee history
2001Patents assigned to INFINEON TECHNOLOGIES NORHT AM (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 16 | 2000–2007 |
| INFINEON TECHNOLOGIES CORP | 2 | 2001–2002 |
| INFINEON TECHNOLOGIES NORHT AM | 1 | 2001 |
| SIEMENS AG | 1 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 16 | 2000–2007 |