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Inventor

Yuuichi Kurashima

Inventor
Ibaraki, JP

Overview

3→
Patents
2017
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems22%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
B23KSoldering or unsoldering11%
H10DInorganic electric semiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
9,761,479'Manufacturing method for semiconductor substrate'20179,751,754'Package formation method and MEMS package'20179,580,306'Room temperature bonding apparatus and room temperature bonding method'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017Patents assigned to NAT INST ADVANCED IND SCIENCE & TECH (3)· patent assignee history
2017Patents assigned to MITSUBISHI HEAVY IND MACHINE TOOL CO LTD (1)· patent assignee history
2017Patents assigned to SICOXS CORP (1)· patent assignee history
2017Patents assigned to TOYOTA JIDOSHOKKI KK (1)· patent assignee history
2017Based in Ibaraki, JP· patent location history
2017Based in Tsukuba, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NAT INST ADVANCED IND SCIENCE & TECH32017
MITSUBISHI HEAVY IND MACHINE TOOL CO LTD12017
SICOXS CORP12017
TOYOTA JIDOSHOKKI KK12017
Locations
LocationPatentsSpan
Ibaraki, JP22017
Tsukuba, JP12017