Inventor
CHAO-WEI CHIU
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H05KPrinted circuits4%
H10NElectric solid-state devices not otherwise provided for4%
PatentTitleYear
12,564,008Method and treatment system for uniform processing of semiconductor devices202612,543,612Semiconductor devices and methods of forming the same202612,368,086Package structure having thermoelectric cooler202512,354,929Package structure and manufacturing method thereof202512,266,559Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece202512,051,655Package structure and method of forming the same202412,051,639Package structure and manufacturing method thereof202411,791,192Workpiece holder, wafer chuck, wafer holding method202311,664,300Fan-out packages and methods of forming the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2023–2026 |