Inventor

Constantine A. Neugebauer

Inventor

Schenectady, NY, US

Overview

31→

Patents

1976–1995

Patent span

Electricity

Primary field (CPC H)

Patents· 31 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%

Y10TTechnical subjects covered by former us classification12%

H05KPrinted circuits8%

C04BLime, magnesia6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

B23KSoldering or unsoldering4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%

G01RMeasuring electric variables2%

H01CResistors2%

PatentTitleYear

5,418,002'Direct bonding of copper to aluminum nitride substrates'1995 5,384,691'High density interconnect multi-chip modules including embedded distributed power supply elements'1995 5,366,906'Wafer level integration and testing'1994 5,336,928'Hermetically sealed packaged electronic system'1994 5,304,847'Direct thermocompression bonding for thin electronic power chips'1994 5,293,070'Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules'1994 5,291,066'Moisture-proof electrical circuit high density interconnect module and method for making same'1994 5,209,390'Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid'1993 5,206,186'Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding'1993 5,184,206'Direct thermocompression bonding for thin electronic power chips'1993 5,166,773'Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid'1992 5,139,972'Batch assembly of high density hermetic packages for power semiconductor chips'1992 5,135,890'Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip'1992 5,105,536'Method of packaging a semiconductor chip in a low inductance package'1992 5,103,290'Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip'1992 5,100,740'Direct bonded symmetric-metallic-laminate/substrate structures'1992 5,043,859'Half bridge device package, packaged devices and circuits'1991 5,028,987'High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip'1991 5,018,002'High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip'1991 4,996,116'Enhanced direct bond structure'1991 4,901,136'Multi-chip interconnection package'1990 4,816,422'Fabrication of large power semiconductor composite by wafer interconnection of individual devices'1989 4,803,450'Multilayer circuit board fabricated from silicon'1989 4,774,632'Hybrid integrated circuit chip package'1988 4,769,744'Semiconductor chip packages having solder layers of enhanced durability'1988 4,750,666'Method of fabricating gold bumps on IC\'s and power chips'1988 4,745,455'Silicon packages for power semiconductor devices'1988 4,646,129'Hermetic power chip packages'1987 4,574,299'Thyristor packaging system'1986 4,103,274'Reconstituted metal oxide varistor'1978 3,993,411'Bonds between metal and a non-metallic substrate'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1995Patents assigned to GEN ELECTRIC (29)· patent assignee history

1976–1995Based in Schenectady, NY, US· patent location history

1994Patents assigned to MARTIN MARIETTA CORP (1)· patent assignee history

1995Patents assigned to HARRIS CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GEN ELECTRIC	29	1976–1995
HARRIS CORP	1	1995
MARTIN MARIETTA CORP	1	1994

Locations

Location	Patents	Span
Schenectady, New York, US	31	1976–1995