Inventor
Richard Alfred Beaupre
Inventor
Pittsfield, MA, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification8%
B23KSoldering or unsoldering4%
H01LSemiconductor devices4%
H01RElectrically-conductive connections4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
H10DInorganic electric semiconductor devices4%
C04BLime, magnesia2%
E04DRoof coverings2%
PatentTitleYear
8,982,558'Cooling device for a power module, and a related method thereof'20158,929,071'Low cost manufacturing of micro-channel heatsink'20158,853,550'Circuit board including mask for controlling flow of solder'20148,772,634'Busbar for power conversion applications'20148,675,379'Power converting apparatus having improved electro-thermal characteristics'20148,622,754'Flexible power connector'20148,586,421'Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance'20138,487,416'Coaxial power module'20138,466,007'Power semiconductor module and fabrication method'20138,358,000'Double side cooled power module with power overlay'20138,310,040'Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof'20128,257,102'Busbar electrical power connector'20128,232,637'Insulated metal substrates incorporating advanced cooling'20128,076,696'Power module assembly with reduced inductance'20118,049,338'Power semiconductor module and fabrication method'20117,919,714'System and a method for controlling flow of solder'20117,915,944'Gate drive circuitry for non-isolated gate semiconductor devices'20117,898,807'Methods for making millichannel substrate, and cooling device and apparatus using the substrate'20117,829,386'Power semiconductor packaging method and structure'20107,817,422'Heat sink and cooling and packaging stack for press-packages'20107,642,449'Photovoltaic integrated building component'20107,518,236'Power circuit package and fabrication method'20097,327,024'Power module, and phase leg assembly'20087,262,444'Power semiconductor packaging method and structure'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2015Patents assigned to GEN ELECTRIC (24)· patent assignee history
2007–2015Based in Pittsfield, MA, US· patent location history
2011–2015Patents assigned to BEAUPRE RICHARD ALFRED (14)· patent assignee history
2011–2014Patents assigned to DELGADO ELADIO CLEMENTE (6)· patent assignee history
2012–2014Patents assigned to GOWDA ARUN VIRUPAKSHA (5)· patent assignee history
2012–2015Patents assigned to SMOLENSKI JOSEPH LUCIAN (4)· patent assignee history
2014Based in Niskayuna, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GEN ELECTRIC | 24 | 2007–2015 |
| BEAUPRE RICHARD ALFREDself | 14 | 2011–2015 |
| DELGADO ELADIO CLEMENTE | 6 | 2011–2014 |
| GOWDA ARUN VIRUPAKSHA | 5 | 2012–2014 |
| SMOLENSKI JOSEPH LUCIAN | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pittsfield, Massachusetts, US | 23 | 2007–2015 |
| Niskayuna, New York, US | 1 | 2014 |