Inventor
Seung-Kon Mok
Inventor
Suwon-si, KR
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H05KPrinted circuits12%
Y02PClimate change mitigation technologies in the production or processing of goods12%
H01LSemiconductor devices10%
Y10TTechnical subjects covered by former us classification10%
B23KSoldering or unsoldering5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
G11CStatic stores2%
PatentTitleYear
11,101,243Semiconductor package202110,483,150Apparatus for stacking semiconductor chips in a semiconductor package20199,793,309'Image sensor package'20179,190,401'Stacked semiconductor packages'20158,803,301'Semiconductor package'20148,759,959'Stacked semiconductor packages'20147,952,199'Circuit board including solder ball land having hole and semiconductor package having the circuit board'20117,667,325'Circuit board including solder ball land having hole and semiconductor package having the circuit board'20107,579,583'Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same'20096,963,033'Ball grid array attaching means having improved reliability and method of manufacturing same'20056,638,638'Hollow solder structure having improved reliability and method of manufacturing same'20035,965,947'Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads'19995,677,569'Semiconductor multi-package stack'19975,621,242'Semiconductor package having support film formed on inner leads'19975,504,373'Semiconductor memory module'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (15)· patent assignee history
1996–1997Based in Seoul, KR· patent location history
1999Based in Kyonggi-do, KR· patent location history
2003–2021Based in Suwon-si, KR· patent location history
2010–2011Based in Chungcheongnam-do, KR· patent location history
2014Patents assigned to MOK SEUNG-KON (2)· patent assignee history
2014Patents assigned to CHO KYONG-SOON (1)· patent assignee history
2014Patents assigned to CHOI DAE-YOUNG (1)· patent assignee history
2014Based in Kyungki-do, KR· patent location history
2017Patents assigned to FUREX CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 15 | 1996–2021 |
| MOK SEUNG-KONself | 2 | 2014 |
| CHO KYONG-SOON | 1 | 2014 |
| CHOI DAE-YOUNG | 1 | 2014 |
| FUREX CO LTD | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 8 | 2003–2021 |
| Seoul, KR | 3 | 1996–1997 |
| Chungcheongnam-do, KR | 2 | 2010–2011 |
| Kyungki-do, KR | 1 | 2014 |
| Kyonggi-do, KR | 1 | 1999 |